-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for W25N512GWPIT by Winbond Electronics Corp
Overview of W25N512GWPIT by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for W25N512GWPIT
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
256-W25N512GWPIT-ND
|
DigiKey | IC FLASH 512MBIT SPI/QUAD 8WSON Lead time: 22 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | |
|
DISTI #
454-W25N512GWPIT
|
Mouser Electronics | NAND Flash 512Mb Serial NAND flash, 1.8V RoHS: Compliant | 0 |
|
Order Now | |
|
|
NAC | 512Mb Serial NAND flash, 1.8V, WSON(6x5mm) Package RoHS: Compliant Min Qty: 570 Package Multiple: 570 | 0 |
|
$1.7900 / $1.8800 | Buy Now |
Part Details for W25N512GWPIT
W25N512GWPIT CAD Models
W25N512GWPIT Part Data Attributes
|
|
W25N512GWPIT
Winbond Electronics Corp
Buy Now
Datasheet
|
Compare Parts:
W25N512GWPIT
Winbond Electronics Corp
Flash,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | HVSON, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Winbond | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| JESD-30 Code | R-PDSO-N8 | |
| Length | 6 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Equivalence Code | SOLCC8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 1.8 V | |
| Seated Height-Max | 0.8 mm | |
| Serial Bus Type | QSPI | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | SLC NAND TYPE | |
| Width | 5 mm |