Datasheets
W25Q128JWYIQ by: Winbond Electronics Corp

Flash, 16MX8, PBGA21, WLCSP-21

Part Details for W25Q128JWYIQ by Winbond Electronics Corp

Overview of W25Q128JWYIQ by Winbond Electronics Corp

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for W25Q128JWYIQ

Part # Distributor Description Stock Price Buy
DISTI # W25Q128JWYIQ
Avnet Asia NOR Flash 128Mbit 16M X 8bit SPI 1.8V 6ns 21-Pin WLCSP (Alt: W25Q128JWYIQ) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 20 Weeks, 0 Days 0
RFQ

Part Details for W25Q128JWYIQ

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W25Q128JWYIQ Part Data Attributes:

W25Q128JWYIQ Winbond Electronics Corp
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W25Q128JWYIQ Winbond Electronics Corp Flash, 16MX8, PBGA21, WLCSP-21
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer WINBOND ELECTRONICS CORP
Package Description VFBGA,
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Date Of Intro 2019-11-07
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 133 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B21
Memory Density 134217728 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 21
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 16MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA21,6X6,20
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 1.8 V
Seated Height-Max 0.5 mm
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

Alternate Parts for W25Q128JWYIQ

This table gives cross-reference parts and alternative options found for W25Q128JWYIQ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q128JWYIQ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
W25Q128FWCIP Flash, 128MX1, PBGA24, 8 X 6 MM, GREEN, TFBGA-24 Winbond Electronics Corp W25Q128JWYIQ vs W25Q128FWCIP
W25Q128FWBIP Flash, 128MX1, PBGA24, 8 X 6 MM, GREEN, TFBGA-24 Winbond Electronics Corp W25Q128JWYIQ vs W25Q128FWBIP
W25Q128FWEIG Flash, 128MX1, PDSO8, WSON-8 Winbond Electronics Corp W25Q128JWYIQ vs W25Q128FWEIG
W25Q128JWSIM Flash, Winbond Electronics Corp W25Q128JWYIQ vs W25Q128JWSIM
W25Q128FWYIC Flash, 16MX8, PBGA32, WLCSP-32 Winbond Electronics Corp W25Q128JWYIQ vs W25Q128FWYIC
W25Q128FWBIG Flash, 128MX1, PBGA24, TFBGA-24 Winbond Electronics Corp W25Q128JWYIQ vs W25Q128FWBIG
W25Q128FWSIF Flash, 16MX8, PDSO8, SOIC-8 Winbond Electronics Corp W25Q128JWYIQ vs W25Q128FWSIF
W25Q128FWPIG Flash, 128MX1, PDSO8, WSON-8 Winbond Electronics Corp W25Q128JWYIQ vs W25Q128FWPIG
W25Q128FWSIG Flash, 128MX1, PDSO8, SOIC-8 Winbond Electronics Corp W25Q128JWYIQ vs W25Q128FWSIG
W25Q128FWEIP Flash, 128MX1, PDSO8, 8 X 6 MM, GREEN, WSON-8 Winbond Electronics Corp W25Q128JWYIQ vs W25Q128FWEIP

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