Part Details for W25Q16CVSSIG by Winbond Electronics Corp
Overview of W25Q16CVSSIG by Winbond Electronics Corp
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for W25Q16CVSSIG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 2644 |
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RFQ |
Part Details for W25Q16CVSSIG
W25Q16CVSSIG CAD Models
W25Q16CVSSIG Part Data Attributes
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W25Q16CVSSIG
Winbond Electronics Corp
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Datasheet
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W25Q16CVSSIG
Winbond Electronics Corp
Flash, 2MX8, 7.5ns, PDSO8, 0.208 INCH, GREEN, SOIC-8
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | SOIC | |
| Package Description | 0.208 INCH, GREEN, SOIC-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Winbond | |
| Access Time-Max | 7.5 ns | |
| Additional Feature | IT ALSO OPERATES AT 2.7V TO 3.6V AT 80MHZ | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | S-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 5.28 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.3 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 2.7 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.16 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.000005 A | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Type | NOR TYPE | |
| Width | 5.28 mm | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for W25Q16CVSSIG
This table gives cross-reference parts and alternative options found for W25Q16CVSSIG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q16CVSSIG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W25Q16BVSSIP | Flash, 2MX8, PDSO8, 0.208 INCH, GREEN, PLASTIC, SOIC-8 | Winbond Electronics Corp | W25Q16CVSSIG vs W25Q16BVSSIP |
| W25Q16BVSSIG | Flash, 2MX8, PDSO8, 0.208 INCH, GREEN, PLASTIC, SOIC-8 | Winbond Electronics Corp | W25Q16CVSSIG vs W25Q16BVSSIG |