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Part Details for W25Q512JVBIM by Winbond Electronics Corp
Overview of W25Q512JVBIM by Winbond Electronics Corp
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Computing and Data Storage
Healthcare
Price & Stock for W25Q512JVBIM
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
W25Q512JVBIM-ND
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DigiKey | IC FLASH 512MBIT SPI 24TFBGA Min Qty: 480 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
|
$5.0516 | Buy Now |
|
|
NAC | spiFlash, 512M-bit, 4Kb Uniform Sector, TFBGA24 (8x6mm-5x5) Package RoHS: Compliant Min Qty: 480 Package Multiple: 480 | 0 |
|
$4.9400 / $5.2000 | Buy Now |
Part Details for W25Q512JVBIM
W25Q512JVBIM CAD Models
W25Q512JVBIM Part Data Attributes
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W25Q512JVBIM
Winbond Electronics Corp
Buy Now
Datasheet
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Compare Parts:
W25Q512JVBIM
Winbond Electronics Corp
Flash,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | TBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Winbond | |
| Alternate Memory Width | 1 | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 6 mm |