Part Details for W25Q64JWTBIM by Winbond Electronics Corp
Overview of W25Q64JWTBIM by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for W25Q64JWTBIM
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
256-W25Q64JWTBIM-ND
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DigiKey | IC FLASH 64MBIT SPI/QUAD 24TFBGA Lead time: 22 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | |
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DISTI #
454-W25Q64JWTBIM
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Mouser Electronics | NOR Flash spiFlash, 32M-bit, DTR, 4Kb Uniform Sector, DTR | 0 |
|
Order Now | |
|
|
NAC | spiFlash, 32M-bit, DTR, 4Kb Uniform Sector, DTR, TFBGA24 (8x6mm-5x5) Package RoHS: Compliant Min Qty: 480 Package Multiple: 480 | 0 |
|
$1.1400 / $1.2000 | Buy Now |
Part Details for W25Q64JWTBIM
W25Q64JWTBIM CAD Models
W25Q64JWTBIM Part Data Attributes:
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W25Q64JWTBIM
Winbond Electronics Corp
Buy Now
Datasheet
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W25Q64JWTBIM
Winbond Electronics Corp
Flash Memory,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | , | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Winbond | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 1.8 V | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | QSPI | |
| Standby Current-Max | 0.000025 A | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |