Part Details for W29C040P-90Z by Winbond Electronics Corp
Overview of W29C040P-90Z by Winbond Electronics Corp
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for W29C040P-90Z
W29C040P-90Z CAD Models
W29C040P-90Z Part Data Attributes
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W29C040P-90Z
Winbond Electronics Corp
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Datasheet
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W29C040P-90Z
Winbond Electronics Corp
Flash, 512KX8, 70ns, PQCC32, PLASTIC, LCC-32
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Part Package Code | QFJ | |
Package Description | PLASTIC, LCC-32 | |
Pin Count | 32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 70 ns | |
JESD-30 Code | R-PQCC-J32 | |
Length | 13.97 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 245 | |
Programming Voltage | 5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.56 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Type | NOR TYPE | |
Width | 11.43 mm | |
Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for W29C040P-90Z
This table gives cross-reference parts and alternative options found for W29C040P-90Z. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W29C040P-90Z, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
M29F040B90K6T | Flash, 512KX8, 70ns, PQCC32, PLASTIC, LCC-32 | Numonyx Memory Solutions | W29C040P-90Z vs M29F040B90K6T |
M29F040B70K1E | 512KX8 FLASH 5V PROM, 70ns, PQCC32, LEAD FREE, PLASTIC, LCC-32 | STMicroelectronics | W29C040P-90Z vs M29F040B70K1E |
M29F040-70KB/T | Flash, 512KX8, 70ns, PQCC32, PLASTIC, LCC-32 | e2v technologies | W29C040P-90Z vs M29F040-70KB/T |
M29F040B70K1T | 512KX8 FLASH 5V PROM, 70ns, PQCC32, PLASTIC, LCC-32 | STMicroelectronics | W29C040P-90Z vs M29F040B70K1T |
M29F040-70XK6 | 512KX8 FLASH 5V PROM, 70ns, PQCC32, PLASTIC, LCC-32 | STMicroelectronics | W29C040P-90Z vs M29F040-70XK6 |
M29F040B70K3 | Flash, 512KX8, 70ns, PQCC32, PLASTIC, LCC-32 | Numonyx Memory Solutions | W29C040P-90Z vs M29F040B70K3 |
AP29F040-70JC | Flash, 512KX8, 70ns, PQCC32, | Integrated Silicon Solution Inc | W29C040P-90Z vs AP29F040-70JC |
MFM8516J-70E | Flash, 512KX8, 70ns, CQCC32, CERAMIC, LCC-32 | APTA Group Inc | W29C040P-90Z vs MFM8516J-70E |
M29F040IF70 | Flash, 512KX8, 70ns, PQCC32, PLASTIC, LCC-32 | Motorola Semiconductor Products | W29C040P-90Z vs M29F040IF70 |
MFM8516JMB-70 | Flash, 512KX8, 70ns, CQCC32, CERAMIC, JLCC-32 | Mosaic Semiconductor Inc | W29C040P-90Z vs MFM8516JMB-70 |