Part Details for W29N02KVBIAE by Winbond Electronics Corp
Overview of W29N02KVBIAE by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Price & Stock for W29N02KVBIAE
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
256-W29N02KVBIAE-ND
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DigiKey | IC FLASH 2GBIT ONFI 63VFBGA Min Qty: 210 Lead time: 28 Weeks Container: Tray | Temporarily Out of Stock |
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$4.3250 | Buy Now |
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DISTI #
454-W29N02KVBIAE
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Mouser Electronics | NAND Flash 2G-bit SLC NAND flash, 3V, 8-bit ECC, 3V, x8 RoHS: Compliant | 0 |
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$4.0000 / $4.2400 | Order Now |
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NAC | 2G-bit Serial NAND flash, 3V, 8-bit ECC, 3V, x8, VFBGA63 (9x11mm) Package RoHS: Compliant Min Qty: 210 Package Multiple: 210 | 0 |
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$4.2700 / $4.4900 | Buy Now |
Part Details for W29N02KVBIAE
W29N02KVBIAE CAD Models
W29N02KVBIAE Part Data Attributes
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W29N02KVBIAE
Winbond Electronics Corp
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Datasheet
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W29N02KVBIAE
Winbond Electronics Corp
Flash,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Winbond | |
| Command User Interface | YES | |
| Data Polling | NO | |
| Data Retention Time-Min | 10 | |
| Endurance | 60000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B63 | |
| Length | 11 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 2K | |
| Number of Terminals | 63 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA63,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Page Size | 1K words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 3 V | |
| Ready/Busy | YES | |
| Seated Height-Max | 1 mm | |
| Sector Size | 128K | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Toggle Bit | YES | |
| Type | SLC NAND TYPE | |
| Width | 9 mm | |
| Write Cycle Time-Max (tWC) | 0.000025 ms |