Part Details for W631GG8NB-15 by Winbond Electronics Corp
Overview of W631GG8NB-15 by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for W631GG8NB-15
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
256-W631GG8NB-15-ND
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DigiKey | IC DRAM 1GBIT SSTL 15 78VFBGA Min Qty: 242 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$2.2281 | Buy Now |
DISTI #
454-W631GG8NB-15
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Mouser Electronics | DRAM 1Gb DDR3 SDRAM, x8, 667MHz RoHS: Compliant | 0 |
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$2.0700 / $3.0000 | Order Now |
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NAC | 1Gb DDR3 SDRAM, x8, 667MHz, WBGA78 Package RoHS: Compliant Min Qty: 242 Package Multiple: 242 | 0 |
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$3.5500 / $3.7400 | Buy Now |
Part Details for W631GG8NB-15
W631GG8NB-15 CAD Models
W631GG8NB-15 Part Data Attributes
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W631GG8NB-15
Winbond Electronics Corp
Buy Now
Datasheet
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W631GG8NB-15
Winbond Electronics Corp
DDR3 DRAM, 128MX8, 20ns, CMOS, PBGA78,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | Winbond | |
Access Mode | MULTI BANK PAGE BURST | |
Access Time-Max | 20 ns | |
Clock Frequency-Max (fCLK) | 667 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 8 | |
JESD-30 Code | R-PBGA-B78 | |
Length | 10.5 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | DDR3 DRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 78 | |
Number of Words | 134217728 words | |
Number of Words Code | 128000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Organization | 128MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA78,9X13,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Seated Height-Max | 1 mm | |
Self Refresh | YES | |
Sequential Burst Length | 8 | |
Standby Current-Max | 0.035 A | |
Supply Current-Max | 0.175 mA | |
Supply Voltage-Max (Vsup) | 1.575 V | |
Supply Voltage-Min (Vsup) | 1.425 V | |
Supply Voltage-Nom (Vsup) | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |