Datasheets
W631GG8NB-15 by: Winbond Electronics Corp

DDR3 DRAM, 128MX8, 20ns, CMOS, PBGA78,

Part Details for W631GG8NB-15 by Winbond Electronics Corp

Overview of W631GG8NB-15 by Winbond Electronics Corp

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for W631GG8NB-15

Part # Distributor Description Stock Price Buy
DISTI # 256-W631GG8NB-15-ND
DigiKey IC DRAM 1GBIT SSTL 15 78VFBGA Min Qty: 242 Lead time: 12 Weeks Container: Tray Temporarily Out of Stock
  • 242 $2.2281
$2.2281 Buy Now
DISTI # 454-W631GG8NB-15
Mouser Electronics DRAM 1Gb DDR3 SDRAM, x8, 667MHz RoHS: Compliant 0
  • 1 $3.0000
  • 10 $2.7000
  • 100 $2.3700
  • 484 $2.2800
  • 968 $2.1300
  • 2,662 $2.0700
$2.0700 / $3.0000 Order Now
NAC 1Gb DDR3 SDRAM, x8, 667MHz, WBGA78 Package RoHS: Compliant Min Qty: 242 Package Multiple: 242 0
  • 242 $3.7400
  • 1,210 $3.5500
$3.5500 / $3.7400 Buy Now

Part Details for W631GG8NB-15

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W631GG8NB-15 Part Data Attributes

W631GG8NB-15 Winbond Electronics Corp
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W631GG8NB-15 Winbond Electronics Corp DDR3 DRAM, 128MX8, 20ns, CMOS, PBGA78,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer WINBOND ELECTRONICS CORP
Reach Compliance Code compliant
Samacsys Manufacturer Winbond
Access Mode MULTI BANK PAGE BURST
Access Time-Max 20 ns
Clock Frequency-Max (fCLK) 667 MHz
I/O Type COMMON
Interleaved Burst Length 8
JESD-30 Code R-PBGA-B78
Length 10.5 mm
Memory Density 1073741824 bit
Memory IC Type DDR3 DRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 78
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 95 °C
Operating Temperature-Min
Organization 128MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA78,9X13,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Seated Height-Max 1 mm
Self Refresh YES
Sequential Burst Length 8
Standby Current-Max 0.035 A
Supply Current-Max 0.175 mA
Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 8 mm

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