Part Details for W631GU6KB-12 by Winbond Electronics Corp
Overview of W631GU6KB-12 by Winbond Electronics Corp
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for W631GU6KB-12
W631GU6KB-12 CAD Models
W631GU6KB-12 Part Data Attributes
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W631GU6KB-12
Winbond Electronics Corp
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Datasheet
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W631GU6KB-12
Winbond Electronics Corp
DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, WBGA-96
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA96,9X16,32 | |
| Pin Count | 96 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.225 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 800 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 8 | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR3L DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 64MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 8 | |
| Standby Current-Max | 0.014 A | |
| Supply Current-Max | 0.4 mA | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 9 mm |
Alternate Parts for W631GU6KB-12
This table gives cross-reference parts and alternative options found for W631GU6KB-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W631GU6KB-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W631GU6KB12J | DDR DRAM, 64MX16, CMOS, PBGA96, WBGA-96 | Winbond Electronics Corp | W631GU6KB-12 vs W631GU6KB12J |
| W631GU6KB12K | DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 | Winbond Electronics Corp | W631GU6KB-12 vs W631GU6KB12K |
| W631GU6MB12J | DDR DRAM, | Winbond Electronics Corp | W631GU6KB-12 vs W631GU6MB12J |
| W631GU6MB12I | DDR DRAM, | Winbond Electronics Corp | W631GU6KB-12 vs W631GU6MB12I |
| W631GU6KB12A | DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 | Winbond Electronics Corp | W631GU6KB-12 vs W631GU6KB12A |