Part Details for W631GU6MB12I by Winbond Electronics Corp
Overview of W631GU6MB12I by Winbond Electronics Corp
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (6 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for W631GU6MB12I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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NAC | 1Gb DDR3L 1.35V SDRAM, x16, Industrial Temp. 800MHz, WBGA96 Package RoHS: Compliant Min Qty: 198 Package Multiple: 198 | 0 |
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$3.9600 / $4.1700 | Buy Now |
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Chip1Cloud | IC DRAM 1GBIT PARALLEL 96VFBGA | 1370 |
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RFQ |
Part Details for W631GU6MB12I
W631GU6MB12I CAD Models
W631GU6MB12I Part Data Attributes:
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W631GU6MB12I
Winbond Electronics Corp
Buy Now
Datasheet
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Compare Parts:
W631GU6MB12I
Winbond Electronics Corp
DDR DRAM,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Date Of Intro | 2017-12-01 | |
| Samacsys Manufacturer | Winbond | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7.5 mm |
Alternate Parts for W631GU6MB12I
This table gives cross-reference parts and alternative options found for W631GU6MB12I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W631GU6MB12I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W631GU6KB12K | DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 | Winbond Electronics Corp | W631GU6MB12I vs W631GU6KB12K |
| W631GU6KB12J | DDR DRAM, 64MX16, CMOS, PBGA96, WBGA-96 | Winbond Electronics Corp | W631GU6MB12I vs W631GU6KB12J |
| W631GU6KB-12 | DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, WBGA-96 | Winbond Electronics Corp | W631GU6MB12I vs W631GU6KB-12 |
| W631GU6MB12J | DDR DRAM, | Winbond Electronics Corp | W631GU6MB12I vs W631GU6MB12J |
| W631GU6KB12I | DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, WBGA-96 | Winbond Electronics Corp | W631GU6MB12I vs W631GU6KB12I |
| W631GU6MB-12 | DDR DRAM, | Winbond Electronics Corp | W631GU6MB12I vs W631GU6MB-12 |