Part Details for W631GU8NB12I by Winbond Electronics Corp
Overview of W631GU8NB12I by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Price & Stock for W631GU8NB12I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
256-W631GU8NB12I-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 78VFBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray |
222 In Stock |
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$2.9884 / $4.1400 | Buy Now |
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DISTI #
454-W631GU8NB12I
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Mouser Electronics | DRAM 1Gb DDR3L 1.35V SDRAM, x8, 800MHz, Industrial Temp RoHS: Compliant | 0 |
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$2.7500 / $4.0100 | Order Now |
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NAC | 1Gb DDR3L 1.35V SDRAM, x8, 800MHz, Industrial Temp, WBGA78 Package RoHS: Compliant Min Qty: 242 Package Multiple: 242 | 0 |
|
$4.2400 / $4.4600 | Buy Now |
Part Details for W631GU8NB12I
W631GU8NB12I CAD Models
W631GU8NB12I Part Data Attributes:
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W631GU8NB12I
Winbond Electronics Corp
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Datasheet
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W631GU8NB12I
Winbond Electronics Corp
DDR3L DRAM, 128MX8, 20ns, CMOS, PBGA78,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Winbond | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 20 ns | |
| Clock Frequency-Max (fCLK) | 800 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 8 | |
| JESD-30 Code | R-PBGA-B78 | |
| Length | 10.5 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR3L DRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 78 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA78,9X13,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 8 | |
| Standby Current-Max | 0.04 A | |
| Supply Current-Max | 0.195 mA | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |