Part Details for W632GG8NB-15 by Winbond Electronics Corp
Overview of W632GG8NB-15 by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for W632GG8NB-15
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
W632GG8NB-15-ND
|
DigiKey | IC DRAM 2GBIT PAR 78VFBGA Min Qty: 242 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
|
$3.8776 | Buy Now |
DISTI #
454-W632GG8NB-15
|
Mouser Electronics | DRAM 2Gb DDR3 SDRAM, x8, 667MHz RoHS: Compliant | 0 |
|
$3.4400 / $3.7600 | Order Now |
|
NAC | 2Gb DDR3 SDRAM, x8, 667MHz, WBGA78 Package RoHS: Compliant Min Qty: 242 Package Multiple: 242 | 0 |
|
$4.3200 / $4.5500 | Buy Now |
Part Details for W632GG8NB-15
W632GG8NB-15 CAD Models
W632GG8NB-15 Part Data Attributes:
|
W632GG8NB-15
Winbond Electronics Corp
Buy Now
Datasheet
|
Compare Parts:
W632GG8NB-15
Winbond Electronics Corp
DDR DRAM,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Package Description | VFBGA-78 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Samacsys Manufacturer | Winbond | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B78 | |
Length | 10.5 mm | |
Memory Density | 2147483648 bit | |
Memory IC Type | DDR3 DRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 78 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Organization | 256MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 1.575 V | |
Supply Voltage-Min (Vsup) | 1.425 V | |
Supply Voltage-Nom (Vsup) | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 8 mm |