Part Details for W634GG6NB12I by Winbond Electronics Corp
Overview of W634GG6NB12I by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
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Price & Stock for W634GG6NB12I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
454-W634GG6NB12I
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Mouser Electronics | DRAM 4Gb DDR3 SDRAM, x16, 800MHz, Industrial Temp, T&R | 0 |
|
$8.5200 / $8.6100 | Order Now |
|
DISTI #
51402598
|
Verical | DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin VFBGA Min Qty: 190 Package Multiple: 190 | Americas - 190 |
|
$14.3206 | Buy Now |
|
|
NAC | 4Gb DDR3 SDRAM, x16, 800MHz, Industrial Temp, T&R, VFBGA96 Package RoHS: Compliant Min Qty: 1 Package Multiple: 190 | 190 |
|
$8.9100 / $9.3800 | Buy Now |
Part Details for W634GG6NB12I
W634GG6NB12I CAD Models
W634GG6NB12I Part Data Attributes:
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W634GG6NB12I
Winbond Electronics Corp
Buy Now
Datasheet
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W634GG6NB12I
Winbond Electronics Corp
DDR DRAM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | VFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Date Of Intro | 2019-07-29 | |
| Samacsys Manufacturer | Winbond | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 9 mm |