Part Details for W66BM6NBUAGI by Winbond Electronics Corp
Overview of W66BM6NBUAGI by Winbond Electronics Corp
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Price & Stock for W66BM6NBUAGI
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
454-W66BM6NBUAGI
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Mouser Electronics | DRAM 2Gb LPDDR4X, x16, 1866MHz, Industrial Temp | 0 |
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$5.4900 / $6.1800 | Order Now |
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NAC | 2Gb LPDDR4X, x16, 1866MHz, Industrial Temp, WFBGA200 Package RoHS: Compliant Min Qty: 144 Package Multiple: 144 | 0 |
|
$5.7500 / $6.0500 | Buy Now |
Part Details for W66BM6NBUAGI
W66BM6NBUAGI CAD Models
W66BM6NBUAGI Part Data Attributes:
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W66BM6NBUAGI
Winbond Electronics Corp
Buy Now
Datasheet
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W66BM6NBUAGI
Winbond Electronics Corp
DDR DRAM,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Date Of Intro | 2019-06-10 | |
Samacsys Manufacturer | Winbond | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMIMAL SUPPLY VOLTAGE; TERM PITCH-MAX | |
Clock Frequency-Max (fCLK) | 1869.1 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 16,32 | |
JESD-30 Code | R-PBGA-B200 | |
Length | 14.5 mm | |
Memory Density | 2147483648 bit | |
Memory IC Type | LPDDR4X DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 200 | |
Number of Words | 134217728 words | |
Number of Words Code | 128000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA200,12X20,32/25 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 0.8 mm | |
Self Refresh | YES | |
Sequential Burst Length | 16,32 | |
Supply Voltage-Max (Vsup) | 1.17 V | |
Supply Voltage-Min (Vsup) | 1.06 V | |
Supply Voltage-Nom (Vsup) | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 10 mm |