Part Details for W971GG8NB25I by Winbond Electronics Corp
Overview of W971GG8NB25I by Winbond Electronics Corp
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for W971GG8NB25I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
256-W971GG8NB25I-ND
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DigiKey | IC DRAM 1GBIT SSTL 18 60VFBGA Min Qty: 264 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$3.0234 | Buy Now |
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DISTI #
454-W971GG8NB25I
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Mouser Electronics | DRAM 1Gb, DDR2-800, x8. Ind temp RoHS: Compliant | 0 |
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$2.5500 / $3.7200 | Order Now |
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NAC | 1Gb, DDR2-800, x8. Ind temp, BGA 60 Package RoHS: Compliant Min Qty: 264 Package Multiple: 264 | 0 |
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$3.3600 / $3.5400 | Buy Now |
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DISTI #
W971GG8NB25I
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Avnet Asia | 1G DDR2 , 8 BIT (Alt: W971GG8NB25I) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 20 Weeks, 0 Days | 0 |
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RFQ |
Part Details for W971GG8NB25I
W971GG8NB25I CAD Models
W971GG8NB25I Part Data Attributes:
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W971GG8NB25I
Winbond Electronics Corp
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Datasheet
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W971GG8NB25I
Winbond Electronics Corp
DDR2 DRAM, 128MX8, CMOS, PBGA60, VFBGA-60
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | VFBGA-60 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Winbond | |
| Access Mode | MULTI BANK PAGE BURST | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B60 | |
| Length | 9.5 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 60 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA60,9X11,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.008 A | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |