There are no models available for this part yet.
Overview of W979H6KBQX2E by Winbond Electronics Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Space Technology
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for W979H6KBQX2E by Winbond Electronics Corp
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
454-W979H6KBQX2E
|
Mouser Electronics | DRAM 512Mb LPDDR2, x16, 400MHz RoHS: Compliant | 0 |
|
Order Now | ||
NAC | 512Mb LPDDR2, x16, 400MHz, PoP (WFBGA) 168 Package RoHS: Compliant Min Qty: 168 Package Multiple: 168 | 0 |
|
RFQ |
CAD Models for W979H6KBQX2E by Winbond Electronics Corp
Part Data Attributes for W979H6KBQX2E by Winbond Electronics Corp
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|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
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WINBOND ELECTRONICS CORP
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Package Description
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VFBGA,
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Reach Compliance Code
|
compliant
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ECCN Code
|
EAR99
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HTS Code
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8542.32.00.28
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Access Mode
|
FOUR BANK PAGE BURST
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Additional Feature
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AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
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JESD-30 Code
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S-PBGA-B168
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Length
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12 mm
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Memory Density
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536870912 bit
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Memory IC Type
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LPDDR2 DRAM
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Memory Width
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16
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Number of Functions
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1
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Number of Ports
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1
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Number of Terminals
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168
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Number of Words
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33554432 words
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Number of Words Code
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32000000
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Operating Mode
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SYNCHRONOUS
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Organization
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32MX16
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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VFBGA
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, VERY THIN PROFILE, FINE PITCH
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Peak Reflow Temperature (Cel)
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NOT SPECIFIED
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Seated Height-Max
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0.8 mm
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Self Refresh
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YES
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Supply Voltage-Max (Vsup)
|
1.3 V
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Supply Voltage-Min (Vsup)
|
1.14 V
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Supply Voltage-Nom (Vsup)
|
1.2 V
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Surface Mount
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YES
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Technology
|
CMOS
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Terminal Form
|
BALL
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Terminal Pitch
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0.5 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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Width
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12 mm
|