Part Details for W979H6KBVX1I by Winbond Electronics Corp
Overview of W979H6KBVX1I by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for W979H6KBVX1I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
256-W979H6KBVX1I-ND
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DigiKey | IC DRAM 512MBIT HSUL 12 134VFBGA Min Qty: 168 Lead time: 28 Weeks Container: Tray | Limited Supply - Call |
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$4.0117 | Buy Now |
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DISTI #
454-W979H6KBVX1I
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Mouser Electronics | DRAM 512Mb LPDDR2, x16, 533MHz, -40 - 85C RoHS: Compliant | 0 |
|
$3.5500 / $4.9100 | Order Now |
|
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NAC | 512Mb LPDDR2, x16, 533MHz, -40 ~ 85C, VFBGA 134 Package RoHS: Compliant Min Qty: 168 Package Multiple: 168 | 0 |
|
$4.6600 / $4.9100 | Buy Now |
Part Details for W979H6KBVX1I
W979H6KBVX1I CAD Models
W979H6KBVX1I Part Data Attributes:
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W979H6KBVX1I
Winbond Electronics Corp
Buy Now
Datasheet
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W979H6KBVX1I
Winbond Electronics Corp
DDR DRAM, 32MX16, CMOS, PBGA134, VFBGA-134
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | VFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 | |
| Access Mode | FOUR BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | |
| JESD-30 Code | R-PBGA-B134 | |
| Length | 11.5 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | LPDDR2 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 134 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.3 V | |
| Supply Voltage-Min (Vsup) | 1.14 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm |