Part Details for W97AH6KBQX2E by Winbond Electronics Corp
Overview of W97AH6KBQX2E by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for W97AH6KBQX2E
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
W97AH6KBQX2E-ND
|
DigiKey | IC DRAM 1G PARALLEL 168WFBGA Lead time: 28 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | |
DISTI #
454-W97AH6KBQX2E
|
Mouser Electronics | DRAM 1Gb LPDDR2, x16, 400MHz, -25 ~ 85C RoHS: Compliant | 0 |
|
Order Now | |
|
NAC | 1Gb LPDDR2, x16, 400MHz, -25 ~ 85C, PoP (WFBGA) 168 Package RoHS: Compliant Min Qty: 168 Package Multiple: 168 | 0 |
|
RFQ |
Part Details for W97AH6KBQX2E
W97AH6KBQX2E CAD Models
W97AH6KBQX2E Part Data Attributes:
|
W97AH6KBQX2E
Winbond Electronics Corp
Buy Now
Datasheet
|
Compare Parts:
W97AH6KBQX2E
Winbond Electronics Corp
DDR DRAM, 64MX16, CMOS, PBGA168, WFBGA-168
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Package Description | VFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 | |
Samacsys Manufacturer | Winbond | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | |
JESD-30 Code | S-PBGA-B168 | |
Length | 12 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | DDR DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 168 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Organization | 64MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Seated Height-Max | 0.8 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.3 V | |
Supply Voltage-Min (Vsup) | 1.14 V | |
Supply Voltage-Nom (Vsup) | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Width | 12 mm |