Part Details for W97BH6MBVA1E by Winbond Electronics Corp
Overview of W97BH6MBVA1E by Winbond Electronics Corp
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for W97BH6MBVA1E
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
256-W97BH6MBVA1E-ND
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DigiKey | IC DRAM 2GBIT HSUL 12 134VFBGA Min Qty: 168 Lead time: 24 Weeks Container: Tray | Temporarily Out of Stock |
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$5.6391 | Buy Now |
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DISTI #
454-W97BH6MBVA1E
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Mouser Electronics | DRAM 2Gb LPDDR2, x16, 533MHz, -25 - 85C | 0 |
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$4.8900 / $5.4500 | Order Now |
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NAC | 2Gb LPDDR2, x16, 533MHz, -25 ~ 85C, VFBGA 134 Package RoHS: Compliant Min Qty: 168 Package Multiple: 168 | 0 |
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$6.2500 / $6.5800 | Buy Now |
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DISTI #
W97BH6MBVA1E
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Avnet Asia | DRAM Chip LPDDR2 SDRAM 2Gbit 128M X 16 1.8V 134-Pin VFBGA (Alt: W97BH6MBVA1E) RoHS: Compliant Min Qty: 1368 Package Multiple: 1368 Lead time: 20 Weeks, 0 Days | 0 |
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RFQ |
Part Details for W97BH6MBVA1E
W97BH6MBVA1E CAD Models
W97BH6MBVA1E Part Data Attributes:
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W97BH6MBVA1E
Winbond Electronics Corp
Buy Now
Datasheet
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Compare Parts:
W97BH6MBVA1E
Winbond Electronics Corp
DDR DRAM,
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | VFBGA-134 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Date Of Intro | 2019-05-22 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | |
| JESD-30 Code | R-PBGA-B134 | |
| Length | 11.5 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | LPDDR2 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 134 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 128MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.3 V | |
| Supply Voltage-Min (Vsup) | 1.14 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm |