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Synchronous DRAM, 32MX16, 5ns, CMOS, PBGA54, VFBGA-54
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
W989D6DBGX6I-ND
|
DigiKey | IC DRAM 512MBIT PAR 54VFBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$2.7224 / $3.7700 | Buy Now |
DISTI #
454-W989D6DBGX6I
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Mouser Electronics | DRAM 512Mb LPSDR, x16, 166MHz, Ind Temp, 46nm RoHS: Compliant | 196 |
|
$2.7200 / $3.8500 | Buy Now |
DISTI #
V36:1790_07052505
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Arrow Electronics | DRAM Chip Mobile LPSDR SDRAM 512Mbit 32Mx16 1.8V 54-Pin VFBGA RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks Date Code: 2328 | Americas - 459 |
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$2.5730 / $3.7280 | Buy Now |
DISTI #
77833517
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Verical | DRAM Chip Mobile LPSDR SDRAM 512Mbit 32Mx16 1.8V 54-Pin VFBGA RoHS: Compliant Min Qty: 3 Package Multiple: 1 Date Code: 2328 | Americas - 459 |
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$2.5730 / $3.7280 | Buy Now |
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NAC | 512Mb LPSDR, x16, 166MHz, Ind Temp, 46nm, VFBGA54 Package RoHS: Compliant Min Qty: 312 Package Multiple: 312 | 0 |
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$3.6700 / $3.8600 | Buy Now |
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Chip1Cloud | LPSDR 166MHz 32Mx16 (512Mb) Ind | 3786 |
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RFQ |
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W989D6DBGX6I
Winbond Electronics Corp
Buy Now
Datasheet
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Compare Parts:
W989D6DBGX6I
Winbond Electronics Corp
Synchronous DRAM, 32MX16, 5ns, CMOS, PBGA54, VFBGA-54
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Package Description | VFBGA-54 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.28 | |
Samacsys Manufacturer | Winbond | |
Access Mode | FOUR BANK PAGE BURST | |
Access Time-Max | 5 ns | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B54 | |
Length | 9 mm | |
Memory Density | 536870912 bit | |
Memory IC Type | SYNCHRONOUS DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 54 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1.025 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 8 mm |