There are no models available for this part yet.
Overview of WS57C43C-55T by STMicroelectronics
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
CAD Models for WS57C43C-55T by STMicroelectronics
Part Data Attributes for WS57C43C-55T by STMicroelectronics
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
STMICROELECTRONICS
|
|
Part Package Code
|
DIP
|
|
Package Description
|
0.300 INCH, CERDIP-24
|
|
Pin Count
|
24
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
55 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-GDIP-T24
|
|
JESD-609 Code
|
e0
|
|
Length
|
32.005 mm
|
|
Memory Density
|
32768 bit
|
|
Memory IC Type
|
UVPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
24
|
|
Number of Words
|
4096 words
|
|
Number of Words Code
|
4000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
4KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP24,.3
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.08 mm
|
|
Standby Current-Max
|
0.03 A
|
|
Supply Current-Max
|
0.03 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
7.62 mm
|
Alternate Parts for WS57C43C-55T
This table gives cross-reference parts and alternative options found for WS57C43C-55T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS57C43C-55T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM2732B-205DC | UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | WS57C43C-55T vs AM2732B-205DC |
| 5962-9065801JX | UVPROM, 4KX8, 70ns, CMOS, CDIP24, CERAMIC, DIP-24 | Waferscale Integration Inc | WS57C43C-55T vs 5962-9065801JX |
| LD2732A-2 | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | WS57C43C-55T vs LD2732A-2 |
| AM2732B-205DI | UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | WS57C43C-55T vs AM2732B-205DI |
| WS57C43B-70D | UVPROM, 4KX8, 70ns, CMOS, CDIP24, | Waferscale Integration Inc | WS57C43C-55T vs WS57C43B-70D |
| WS57C43C-25D | 4KX8 UVPROM, 25ns, CDIP24, 0.600 INCH, CERDIP-24 | STMicroelectronics | WS57C43C-55T vs WS57C43C-25D |
| PQ36C32-55 | EEPROM, 4KX8, 55ns, Parallel, CMOS, PDIP24 | LSI Corporation | WS57C43C-55T vs PQ36C32-55 |
| 5962-9065804JX | UVPROM, 4KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 | Waferscale Integration Inc | WS57C43C-55T vs 5962-9065804JX |
| MD2732A-25 | UVPROM, 4KX8, 250ns, CMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | WS57C43C-55T vs MD2732A-25 |
| WS57C43C-45TMB | 4KX8 UVPROM, 45ns, CDIP24, 0.300 INCH, CERDIP-24 | STMicroelectronics | WS57C43C-55T vs WS57C43C-45TMB |