Part Details for XC17128DDD8M by AMD Xilinx
Overview of XC17128DDD8M by AMD Xilinx
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for XC17128DDD8M
XC17128DDD8M CAD Models
XC17128DDD8M Part Data Attributes
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XC17128DDD8M
AMD Xilinx
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Datasheet
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XC17128DDD8M
AMD Xilinx
128KX1 CONFIGURATION MEMORY, CDIP8, CERAMIC, DIP-8
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | DIP | |
Package Description | CERAMIC, DIP-8 | |
Pin Count | 8 | |
Reach Compliance Code | unknown | |
Clock Frequency-Max (fCLK) | 12.5 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T8 | |
JESD-609 Code | e0 | |
Length | 10.16 mm | |
Memory Density | 131072 bit | |
Memory IC Type | CONFIGURATION MEMORY | |
Memory Width | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 128KX1 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Power Supplies | 5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Standby Current-Max | 0.00005 A | |
Supply Current-Max | 0.01 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 7.62 mm |
Alternate Parts for XC17128DDD8M
This table gives cross-reference parts and alternative options found for XC17128DDD8M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC17128DDD8M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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XC17128D-DD8M | Configuration Memory, 128KX1, Serial, CMOS, CDIP8, CERDIP-8 | AMD Xilinx | XC17128DDD8M vs XC17128D-DD8M |
MPA17128PC | OTP ROM, 128KX1, CMOS, PDIP8, PLASTIC, DIP-8 | Motorola Semiconductor Products | XC17128DDD8M vs MPA17128PC |
XC17128D-PD8I | 128KX1 CONFIGURATION MEMORY, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17128DDD8M vs XC17128D-PD8I |
MCP17128IN | OTP ROM, 128KX1, CMOS, PDIP8, PLASTIC, DIP-8 | Motorola Semiconductor Products | XC17128DDD8M vs MCP17128IN |
XC17128DPD8I | Configuration Memory, 128KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17128DDD8M vs XC17128DPD8I |
XC17128D-DDG8M | Configuration Memory, 128KX1, Serial, CMOS, CDIP8, CERDIP-8 | AMD Xilinx | XC17128DDD8M vs XC17128D-DDG8M |
MCP17128IN | 128KX1 OTPROM, PDIP8, PLASTIC, DIP-8 | Motorola Mobility LLC | XC17128DDD8M vs MCP17128IN |
MCP17128CN | 128KX1 OTPROM, PDIP8, PLASTIC, DIP-8 | Motorola Mobility LLC | XC17128DDD8M vs MCP17128CN |
XC17128DPD8C | Configuration Memory, 128KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17128DDD8M vs XC17128DPD8C |