Part Details for XC17256EPD8I by AMD Xilinx
Overview of XC17256EPD8I by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for XC17256EPD8I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 1 |
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RFQ |
Part Details for XC17256EPD8I
XC17256EPD8I CAD Models
XC17256EPD8I Part Data Attributes
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XC17256EPD8I
AMD Xilinx
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Datasheet
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XC17256EPD8I
AMD Xilinx
Configuration Memory, 256KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | PLASTIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | |
| Clock Frequency-Max (fCLK) | 15 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T8 | |
| JESD-609 Code | e0 | |
| Length | 9.3599 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Memory Width | 1 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.5974 mm | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7.62 mm |
Alternate Parts for XC17256EPD8I
This table gives cross-reference parts and alternative options found for XC17256EPD8I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC17256EPD8I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XC17256EDD8B | Configuration Memory, 256KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | AMD Xilinx | XC17256EPD8I vs XC17256EDD8B |
| XC17256EPD8C | Configuration Memory, 256KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17256EPD8I vs XC17256EPD8C |
| XC17256EDD8M | Configuration Memory, 256KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | AMD Xilinx | XC17256EPD8I vs XC17256EDD8M |
| XC17256EPDG8C | Configuration Memory, 256KX1, Serial, CMOS, PDIP8, LEAD FREE, PLASTIC, DIP-8 | AMD Xilinx | XC17256EPD8I vs XC17256EPDG8C |