Part Details for XCF08PFSG48C by AMD Xilinx
Overview of XCF08PFSG48C by AMD Xilinx
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Robotics and Drones
Price & Stock for XCF08PFSG48C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | XCF08P - Platform Flash In-System Programmable Configuration PROMs RoHS: Compliant Status: Obsolete Min Qty: 1 | 2854 |
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$57.5200 / $67.6700 | Buy Now |
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NexGen Digital | 4 |
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RFQ | ||
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Chip1Cloud | IC PROM SRL 1.8V 8M GATE 48CSBGA | 1140 |
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RFQ | |
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Win Source Electronics | IC PROM SRL 1.8V 8M GATE 48CSBGA | 4166 |
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$36.7400 / $55.1090 | Buy Now |
Part Details for XCF08PFSG48C
XCF08PFSG48C CAD Models
XCF08PFSG48C Part Data Attributes:
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XCF08PFSG48C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCF08PFSG48C
AMD Xilinx
Configuration Memory, 8MX1, Serial, CMOS, PBGA48, LEAD-FREE, PLASTIC, TFBGA-48
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD-FREE, PLASTIC, TFBGA-48 | |
| Pin Count | 48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | |
| Clock Frequency-Max (fCLK) | 33 MHz | |
| Endurance | 20000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B48 | |
| JESD-609 Code | e2 | |
| Length | 9 mm | |
| Memory Density | 8388608 bit | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Memory Width | 1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX1 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA48,6X8,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.001 A | |
| Supply Current-Max | 0.04 mA | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.65 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Type | NOR TYPE | |
| Width | 8 mm |