There are no models available for this part yet.
Overview of XPC857TZP50B by Freescale Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for XPC857TZP50B by Freescale Semiconductor
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
ComSIT USA | POWERQUICC PROCESSOR RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357 RoHS: Not Compliant |
|
|
RFQ |
CAD Models for XPC857TZP50B by Freescale Semiconductor
Part Data Attributes for XPC857TZP50B by Freescale Semiconductor
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code
|
BGA
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Package Description
|
BGA, BGA357,19X19,50
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Pin Count
|
357
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Reach Compliance Code
|
not_compliant
|
ECCN Code
|
5A991
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HTS Code
|
8542.31.00.01
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Address Bus Width
|
32
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Bit Size
|
32
|
Boundary Scan
|
YES
|
External Data Bus Width
|
32
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Format
|
FIXED POINT
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Integrated Cache
|
YES
|
JESD-30 Code
|
S-PBGA-B357
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JESD-609 Code
|
e0
|
Length
|
25 mm
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Low Power Mode
|
YES
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Moisture Sensitivity Level
|
3
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Number of Terminals
|
357
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Package Body Material
|
PLASTIC/EPOXY
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Package Code
|
BGA
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Package Equivalence Code
|
BGA357,19X19,50
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Package Shape
|
SQUARE
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Package Style
|
GRID ARRAY
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Peak Reflow Temperature (Cel)
|
220
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Qualification Status
|
Not Qualified
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Seated Height-Max
|
2.05 mm
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Speed
|
50 MHz
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Supply Voltage-Max
|
3.465 V
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Supply Voltage-Min
|
3.135 V
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Supply Voltage-Nom
|
3.3 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Terminal Finish
|
Tin/Lead (Sn/Pb)
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Terminal Form
|
BALL
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Terminal Pitch
|
1.27 mm
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Terminal Position
|
BOTTOM
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Time@Peak Reflow Temperature-Max (s)
|
30
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Width
|
25 mm
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uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
Alternate Parts for XPC857TZP50B
This table gives cross-reference parts and alternative options found for XPC857TZP50B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC857TZP50B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MPC860ENCVR50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, PCMCIA, -40 to 95C | Freescale Semiconductor | XPC857TZP50B vs MPC860ENCVR50D4 |
TSPC860MHVZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC857TZP50B vs TSPC860MHVZPU50C1 |
MPC860DECZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC857TZP50B vs MPC860DECZQ50D4 |
MPC860SRCZP50D4 | MPC860SRCZP50D4 | Motorola Semiconductor Products | XPC857TZP50B vs MPC860SRCZP50D4 |
MPC860SRZQ50D4R2 | RISC Microprocessor | NXP Semiconductors | XPC857TZP50B vs MPC860SRZQ50D4R2 |
MPC860SRCZQ50D4 | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, -40 to 95C | Freescale Semiconductor | XPC857TZP50B vs MPC860SRCZQ50D4 |
TSXPC860MHVZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, PBGA357 | Microchip Technology Inc | XPC857TZP50B vs TSXPC860MHVZPU50C1 |
MPC860TCVR50D4 | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, -40 to 95C | Freescale Semiconductor | XPC857TZP50B vs MPC860TCVR50D4 |
MPC855TZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC857TZP50B vs MPC855TZQ50D4 |
XPC860PZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC857TZP50B vs XPC860PZP50D3 |