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31 - 40 of 389,050 results
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MCMR25V336M5X7
SPC Multicomp
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$0.0977 | Active | 33 µF | 25 V | 20 % | POLARIZED | 20 % | THROUGH HOLE MOUNT | ALUMINUM (WET) | ALUMINUM ELECTROLYTIC CAPACITOR | 8.25 µA | 0.14 | 85 °C | -40 °C | 2 | CYLINDRICAL PACKAGE | Radial | NO | WIRE | 5 mm | 7 mm | MULTICOMP PRO | RADIAL LEADED | unknown | |||||||||||||||||||
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MC0603B152J500CT
SPC Multicomp
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$0.0045 | Yes | Active | 1.5 nF | 50 V | 5 % | 0603 | X7R | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | |||||||||||
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MCU0603C221JCT
SPC Multicomp
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$0.0149 | Yes | Active | 220 pF | 50 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | |||||||||||
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MC0603B102J101CT
SPC Multicomp
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$0.0126 | Yes | Active | 1 nF | 100 V | 5 % | 0603 | X7R | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | |||||||||||
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CGP5C470KDSDAA7301
KEMET Corporation
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$1.0110 | Active | 47 pF | 1 kV | 10 % | SL | 10 % | THROUGH HOLE MOUNT | No | CERAMIC | CERAMIC CAPACITOR | -1000,350 ppm/°C | 85 °C | -25 °C | 2 | Radial | TR | NO | 5 mm | WIRE | 5.5 mm | 5.5 mm | 4 mm | KEMET ELECTRONICS CORP | RADIAL LEADED | unknown | EAR99 | 8532.23.00.60 | KEMET | ||||||||||||||
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MCU0603C220JCT
SPC Multicomp
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$0.0130 | Yes | Active | 22 pF | 50 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | |||||||||||
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293D105X9020A2TE3
Vishay Intertechnologies
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$0.1007 | Yes | Active | 1 µF | 20 V | 36 mA | 10 % | 1206 | 8.4 Ω | POLARIZED | 10 % | SURFACE MOUNT | TANTALUM (DRY/SOLID) | TANTALUM CAPACITOR | 500 nA | 0.04 | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, EMBOSSED PLASTIC, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | J BEND | 1.6 mm | 3.2 mm | 1.6 mm | VISHAY INTERTECHNOLOGY INC | CHIP | compliant | Vishay | ||||||||||
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AC0603FRNPO9BN102
YAGEO Corporation
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$0.1637 | Yes | Active | 1 nF | 50 V | 1 % | 0603 | C0G | 1 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | YAGEO CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | YAGEO | ||||||||||
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293D224X9035A2TE3
Vishay Intertechnologies
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$0.2598 | Yes | Active | 220 nF | 35 V | 28 mA | 10 % | 1206 | 15 Ω | POLARIZED | 10 % | SURFACE MOUNT | TANTALUM (DRY/SOLID) | TANTALUM CAPACITOR | 500 nA | 0.04 | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, EMBOSSED PLASTIC, 7 INCH | YES | MATTE TIN OVER NICKEL | J BEND | 1.6 mm | 3.2 mm | 1.6 mm | VISHAY INTERTECHNOLOGY INC | CHIP | compliant | Vishay | ||||||||||
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AC0603FRNPO9BN221
YAGEO Corporation
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$0.1041 | Yes | Active | 220 pF | 50 V | 1 % | 0603 | C0G | 1 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | YAGEO CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | YAGEO |