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AD9695BCPZ-625
Analog Devices Inc
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$0.2832 | No | Yes | Active | 950 mV | 2.04 V | 2 | 0.0305 % | 14 | 625 MHz | YES | ADC, PROPRIETARY METHOD | -2.04 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | INDUSTRIAL | SERIAL | S-XQCC-N64 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | UNSPECIFIED | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LFCSP-6 | 64 | CP-64-17 | Compliant | 3A001.A.5.A.4 | 8542.39.00.01 | 2017-09-18 | |||||||||||
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AD9266BCPZ-80
Analog Devices Inc
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$0.3903 | No | Yes | Active | 1.8 V | 2 V | 1 | 0.0094 % | 16 | 80 MHz | 12.5 ns | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 1 mm | 5 mm | HVQCCN, LCC32,.2SQ,20 | 32 | CP-32-12 | Compliant | 3A001.A.5.A.5 | 8542.39.00.01 | QFN | |||||||
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ADC081S021CIMF/NOPB
Texas Instruments
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$0.4770 | Yes | Yes | Active | 3 V | 5.25 V | 1 | 0.1172 % | 8 | 200 kHz | 16 µs | YES | ADC, SUCCESSIVE APPROXIMATION | 1 | BINARY | TRACK | 2.2 mA | 2.7 V | CMOS | INDUSTRIAL | SERIAL | R-PDSO-G6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | LSSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Tin (Sn) | GULL WING | 950 µm | DUAL | 1.6 mm | 1.45 mm | 2.9 mm | LSSOP, TSOP6,.11,37 | 6 | Compliant | 8542.39.00.30 | SOT-23 | |||||||
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ADC081C021CIMMX/NOPB
Texas Instruments
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$0.4770 | Yes | Yes | Active | 3 V | 5.5 V | 1 | 0.0781 % | 8 | 189 kHz | 179 µs | YES | ADC, SUCCESSIVE APPROXIMATION | 1 | BINARY | TRACK | 1.2 mA | 2.7 V | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | S-PDSO-G8 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Tin (Sn) | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | TSSOP, TSSOP8,.19 | 8 | Compliant | 8542.39.00.01 | SSOP | |||||||
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ADC081S021CIMFX/NOPB
Texas Instruments
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$0.4770 | Yes | Yes | Active | 3 V | 5.25 V | 1 | 0.1172 % | 8 | 200 kHz | 16 µs | YES | ADC, SUCCESSIVE APPROXIMATION | 1 | BINARY | TRACK | 2.2 mA | 2.7 V | CMOS | INDUSTRIAL | SERIAL | R-PDSO-G6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | LSSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Tin (Sn) | GULL WING | 950 µm | DUAL | 1.6 mm | 1.45 mm | 2.9 mm | LSSOP, TSOP6,.11,37 | 6 | Compliant | 8542.39.00.01 | SOT-23 | |||||||
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ADC081C021CIMK/NOPB
Texas Instruments
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$0.4770 | Yes | Yes | Active | 3 V | 5.5 V | 1 | 0.0781 % | 8 | 189 kHz | 179 µs | YES | ADC, SUCCESSIVE APPROXIMATION | 1 | BINARY | TRACK | 1.2 mA | 2.7 V | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | R-PDSO-G6 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | TSSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Tin (Sn) | GULL WING | 950 µm | DUAL | 1.6 mm | 1.1 mm | 2.9 mm | TSSOP, TSOP6,.11,37 | 6 | Compliant | 8542.39.00.01 | SOT | |||||||
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ADC081C027CIMKX/NOPB
Texas Instruments
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$0.4770 | Yes | Yes | Active | 3 V | 5.5 V | 1 | 0.0781 % | 8 | 189 kHz | 179 µs | YES | ADC, SUCCESSIVE APPROXIMATION | 1 | BINARY | TRACK | 990 µA | 2.7 V | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | R-PDSO-G6 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VSSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | Tin (Sn) | GULL WING | 950 µm | DUAL | 1.65 mm | 1 mm | 2.97 mm | VSSOP, TSOP6,.11,37 | 6 | Compliant | 8542.39.00.01 | SOT | |||||||
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ADC081S021CISD/NOPB
Texas Instruments
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$0.4770 | Yes | Yes | Active | 3 V | 5.25 V | 1 | 0.1172 % | 8 | 200 kHz | 16 µs | YES | ADC, SUCCESSIVE APPROXIMATION | 1 | BINARY | TRACK | 2.2 mA | 2.7 V | CMOS | INDUSTRIAL | SERIAL | R-PDSO-N6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.1,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 650 µm | DUAL | 2.2 mm | 800 µm | 2.5 mm | HVSON, SOLCC6,.1,25 | 6 | Compliant | 8542.39.00.01 | SON | |||||||
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MCP3221A6T-E/OT
Microchip Technology Inc
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$0.5144 | Yes | Yes | Active | 5 V | 5.8 V | 1 | 0.0488 % | 12 | 22.3 kHz | YES | ADC, SUCCESSIVE APPROXIMATION | -300 mV | 1 | BINARY | SAMPLE | 250 µA | CMOS | AUTOMOTIVE | SERIAL | R-PDSO-G5 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | TS 16949 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 950 µm | DUAL | 1.63 mm | 1.45 mm | 2.95 mm | LSSOP, TSOP5/6,.11,37 | 5 | SOT-23-5 | Compliant | EAR99 | 8542.39.00.01 | SOT-23 | ||||||
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ADS7040IDCUR
Texas Instruments
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$0.5212 | Yes | Yes | Active | 3 V | 3.6 V | 1 | 0.19531 % | 8 | 1 MHz | 10 ns | YES | ADC, SUCCESSIVE APPROXIMATION | 1 | BINARY | SAMPLE | 185 µA | 1.65 V | AUTOMOTIVE | SERIAL | R-PDSO-G8 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | VSSOP | TSSOP8,.12,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | DUAL | 2 mm | 900 µm | 2.3 mm | VSSOP, TSSOP8,.12,20 | Compliant | EAR99 | 8542.39.00.30 |