Parametric results for: Other Interface ICs
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CIM-52S7V-T
Citizen Finedevice Co Ltd
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Check for Price | Active | 3 V | INTERFACE CIRCUIT | 1 | 5.5 V | 2.4 V | NO | R-XSMA-N8 | Not Qualified | 8 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO LEAD | SINGLE | CITIZEN ELECTRONICS CO LTD | MODULE | , | 8 | unknown | 8542.39.00.01 | ||||||||||||||||||||||||||||||||
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GTL2012DP,118
NXP Semiconductors
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$0.8936 | Yes | Active | 3.3 V | INTERFACE CIRCUIT | 1 | 3.6 V | 3 V | YES | INDUSTRIAL | S-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | NXP SEMICONDUCTORS | TSSOP | 3 MM, PLASTIC, SOT505-1, TSSOP-8 | 8 | compliant | 8542.39.00.01 | SOT505-1 | NXP | |||||||||||||||
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FXL4TD245BQX
Fairchild Semiconductor Corporation
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$0.6518 | Yes | Yes | Transferred | 1.2 V | 3-STATE | 4 | VOLTAGE LEVEL TRANSLATOR | 22 ns | 1 | TRUE | 100 mA | 3.6 V | 1.1 V | YES | INDUSTRIAL | R-XQCC-N16 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 3.5 mm | 800 µm | 2.5 mm | FAIRCHILD SEMICONDUCTOR CORP | MLP | 2.50 X 3.50 MM, GREEN, MO-241AB, DQFN-16 | 16 | compliant | 8542.39.00.01 | 16LD,DQFN,JEDEC MO-241,2.5 X 3.5MM | EAR99 | |||||||||
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VNI8200XP
STMicroelectronics
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$5.9349 | Yes | Active | 24 V | 8 | INTERFACE CIRCUIT | 1 | 700 mA | 36 V | 10.5 V | YES | AUTOMOTIVE | R-PDSO-G36 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 30 | 36 | PLASTIC/EPOXY | HSSOP | SSOP36,.4,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 10.3 mm | 2.47 mm | 7.5 mm | STMICROELECTRONICS | SSOP | 36 | not_compliant | 8542.39.00.01 | STMicroelectronics | EAR99 | ||||||||||||||
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ISL58303DRTZ-T7A
Intersil Corporation
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Check for Price | Unknown | INTERFACE CIRCUIT | 1 | YES | S-XQCC-N24 | e3 | 1 | 260 | 30 | 24 | UNSPECIFIED | QCCN | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | QUAD | INTERSIL CORP | TQFN | 4 X 4 MM, TQFN-24 | 24 | compliant | 2016-09-01 | ||||||||||||||||||||||||||||||
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LC898121XA-MH
onsemi
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$2.5018 | Yes | Active | 3 V | INTERFACE CIRCUIT | CMOS | 1 | 3.6 V | 2.6 V | 5.5 V | 2.6 V | YES | R-PBGA-B40 | e1 | 1 | 260 | 30 | 40 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 3.94 mm | 650 µm | 2.44 mm | ONSEMI | WLCSP40, 2.44x3.94 | 3.94 X 2.44 MM, 0.65 MM HEIGHT, HALOGEN AND LEAD FREE, WLCSP-40 | compliant | 567JB | onsemi | |||||||||||||||||||
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935298348125
NXP Semiconductors
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Check for Price | Active | 2.2 V | INTERFACE CIRCUIT | CMOS | 1 | 3.6 V | 1.1 V | YES | INDUSTRIAL | R-PQCC-N8 | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | QCCN | RECTANGULAR | CHIP CARRIER | NICKEL PALLADIUM GOLD | NO LEAD | QUAD | 1.4 mm | 500 µm | 1.2 mm | NXP SEMICONDUCTORS | , | unknown | 8542.39.00.01 | ||||||||||||||||||||||
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DR65-0002-TBP
MACOM
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Check for Price | Obsolete | 5 V | INTERFACE CIRCUIT | 1 | 12 V | 3 V | YES | INDUSTRIAL | R-PDSO-G16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | GULL WING | 1.27 mm | DUAL | 10.3 mm | 2.65 mm | 7.5 mm | M/A-COM TECHNOLOGY SOLUTIONS INC | SOIC | SOP, | 16 | compliant | 8542.39.00.01 | ||||||||||||||||||||||||
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ADUM1311ARWZ
Analog Devices Inc
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$3.5809 | No | Yes | Active | 3 V | INTERFACE CIRCUIT | CMOS | 1 | 5.5 V | 2.7 V | YES | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | Matte Tin (Sn) - annealed | GULL WING | 1.27 mm | DUAL | 10.3 mm | 2.65 mm | 7.5 mm | ANALOG DEVICES INC | SOIC | SOIC-16 | 16 | compliant | 8543.70.98.60 | RW-16 | Analog Devices | EAR99 | |||||||||||||
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MC33SB0400ESR2
NXP Semiconductors
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$8.2550 | Yes | Active | 5 V | INTERFACE CIRCUIT | MOS | 1 | 5.25 V | 4.75 V | YES | AUTOMOTIVE | S-XQCC-N48 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 48 | UNSPECIFIED | HQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Tin (Sn) | NO LEAD | QUAD | NXP SEMICONDUCTORS | QFN-48 | compliant | 8542.39.00.01 | NXP | EAR99 |