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P2416
Intel Corporation
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Check for Price | No | Obsolete | 1.024 kbit | 4 | 256X4 | OTHER DRAM | 256 | 256 words | PMOS | COMMERCIAL EXTENDED | R-PDIP-T18 | Not Qualified | e0 | 80 °C | 10 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INTEL CORP | DIP, DIP18,.3 | unknown | EAR99 | 8542.32.00.02 | ||||||||||||||||||||||||
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MYX4DD3512M72PBG2-IT
Micross Components
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Check for Price | No | Active | 38.6547 Gbit | 72 | 512MX72 | 1.35 V | 125 ns | 667 MHz | MULTI BANK PAGE BURST | DDR3 DRAM | SEATED HGT-CALCULATED | COMMON | 8 | 1 | 1 | 512 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 75 µA | 1.15 mA | 1.45 V | 1.283 V | CMOS | R-PBGA-B375 | 85 °C | -40 °C | 375 | PLASTIC/EPOXY | BGA | BGA375,18X21,40 | RECTANGULAR | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 2.96 mm | 21.625 mm | 19.125 mm | MICROSS COMPONENTS | , | compliant | EAR99 | |||||||||
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MYX4DD3512M72PBG2R-ET
Micross Components
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Check for Price | Yes | Active | 38.6547 Gbit | 72 | 512MX72 | 1.35 V | 125 ns | 667 MHz | MULTI BANK PAGE BURST | DDR3 DRAM | SEATED HGT-CALCULATED | COMMON | 8 | 1 | 1 | 512 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 75 µA | 1.15 mA | 1.45 V | 1.283 V | CMOS | R-PBGA-B375 | 105 °C | -40 °C | 375 | PLASTIC/EPOXY | BGA | BGA375,18X21,40 | RECTANGULAR | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 2.96 mm | 21.625 mm | 19.125 mm | MICROSS COMPONENTS | , | compliant | EAR99 | |||||||||
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MYX4DD3512M72PBG2R-IT
Micross Components
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Check for Price | Yes | Active | 38.6547 Gbit | 72 | 512MX72 | 1.35 V | 125 ns | 667 MHz | MULTI BANK PAGE BURST | DDR3 DRAM | SEATED HGT-CALCULATED | COMMON | 8 | 1 | 1 | 512 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 75 µA | 1.15 mA | 1.45 V | 1.283 V | CMOS | R-PBGA-B375 | 85 °C | -40 °C | 375 | PLASTIC/EPOXY | BGA | BGA375,18X21,40 | RECTANGULAR | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 2.96 mm | 21.625 mm | 19.125 mm | MICROSS COMPONENTS | , | compliant | EAR99 | |||||||||
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MYX4DD3512M72PBG2-XT
Micross Components
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Check for Price | No | Active | 38.6547 Gbit | 72 | 512MX72 | 1.35 V | 125 ns | 667 MHz | MULTI BANK PAGE BURST | DDR3 DRAM | SEATED HGT-CALCULATED | COMMON | 8 | 1 | 1 | 512 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 75 µA | 1.15 mA | 1.45 V | 1.283 V | CMOS | R-PBGA-B375 | 125 °C | -55 °C | 375 | PLASTIC/EPOXY | BGA | BGA375,18X21,40 | RECTANGULAR | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 2.96 mm | 21.625 mm | 19.125 mm | MICROSS COMPONENTS | , | compliant | EAR99 | |||||||||
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MYX4DD3512M72PBG2-ET
Micross Components
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Check for Price | No | Active | 38.6547 Gbit | 72 | 512MX72 | 1.35 V | 125 ns | 667 MHz | MULTI BANK PAGE BURST | DDR3 DRAM | SEATED HGT-CALCULATED | COMMON | 8 | 1 | 1 | 512 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 75 µA | 1.15 mA | 1.45 V | 1.283 V | CMOS | R-PBGA-B375 | 105 °C | -40 °C | 375 | PLASTIC/EPOXY | BGA | BGA375,18X21,40 | RECTANGULAR | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 2.96 mm | 21.625 mm | 19.125 mm | MICROSS COMPONENTS | , | compliant | EAR99 | |||||||||
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MYX4DD3512M72PBG2-XX
Micross Components
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Check for Price | No | Active | 38.6547 Gbit | 72 | 512MX72 | 1.35 V | 100 ns | 800 MHz | MULTI BANK PAGE BURST | DDR3 DRAM | SEATED HGT-CALCULATED | COMMON | 8 | 1 | 1 | 512 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 75 µA | 1.35 mA | 1.45 V | 1.283 V | CMOS | R-PBGA-B375 | 375 | PLASTIC/EPOXY | BGA | BGA375,18X21,40 | RECTANGULAR | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 2.96 mm | 21.625 mm | 19.125 mm | MICROSS COMPONENTS | , | compliant | EAR99 | |||||||||||
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MYX4DD3512M72PBG2R-XX
Micross Components
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Check for Price | Yes | Active | 38.6547 Gbit | 72 | 512MX72 | 1.35 V | 100 ns | 800 MHz | MULTI BANK PAGE BURST | DDR3 DRAM | SEATED HGT-CALCULATED | COMMON | 8 | 1 | 1 | 512 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 75 µA | 1.35 mA | 1.45 V | 1.283 V | CMOS | R-PBGA-B375 | 375 | PLASTIC/EPOXY | BGA | BGA375,18X21,40 | RECTANGULAR | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 2.96 mm | 21.625 mm | 19.125 mm | MICROSS COMPONENTS | , | compliant | EAR99 | |||||||||||
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MYX4DD3512M72PBG2R-XT
Micross Components
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Check for Price | Yes | Active | 38.6547 Gbit | 72 | 512MX72 | 1.35 V | 125 ns | 667 MHz | MULTI BANK PAGE BURST | DDR3 DRAM | SEATED HGT-CALCULATED | COMMON | 8 | 1 | 1 | 512 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 75 µA | 1.15 mA | 1.45 V | 1.283 V | CMOS | R-PBGA-B375 | 125 °C | -55 °C | 375 | PLASTIC/EPOXY | BGA | BGA375,18X21,40 | RECTANGULAR | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 2.96 mm | 21.625 mm | 19.125 mm | MICROSS COMPONENTS | , | compliant | EAR99 | |||||||||
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M38510/24904BVX
Texas Instruments
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Check for Price | Obsolete | 1.024 kbit | 1 | 1KX1 | 5 V | 150 ns | PAGE | PAGE MODE DRAM | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 1 | 1 | 1000 | 1.024 k | ASYNCHRONOUS | 5.5 V | 4.5 V | CMOS | MILITARY | R-XDIP-T18 | Not Qualified | 125 °C | -55 °C | 18 | UNSPECIFIED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | TEXAS INSTRUMENTS INC | DIP, | unknown | EAR99 | 8542.32.00.02 | DIP | 16 |