Findchips: Parametric Search Results for MT47H64M16HR-3%3AH

Parametric results for: MT47H64M16HR-3%3AH under DRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		MT47H64M16HR-3AT:G Micron Technology Inc
		MT47H64M16HR-3LAT:E Micron Technology Inc
		MT47H64M16HR-37ELAT:H Micron Technology Inc
		MT47H64M16HR-37EAT:G Micron Technology Inc
		MT47H64M16HR-3IT:E Micron Technology Inc
		MT47H64M16HR-37ELAT:G Micron Technology Inc
		MT47H64M16HR-3ELAT:H Micron Technology Inc
		MT47H64M16HR-3AIT:H Micron Technology Inc
		MT47H64M16HR-3:E Micron Technology Inc
		MT47H64M16HR-3LAAT:H Micron Technology Inc

				Most Relevant								Technical																		Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Interleaved Burst Length	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Self Refresh	Sequential Burst Length	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

350 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

unknown

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

350 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

500 ps

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

500 ps

267 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

330 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

350 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

unknown

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

500 ps

267 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

330 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

230 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

230 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

AEC-Q100

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

350 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

not_compliant

EAR99

8542.32.00.32

Check for Price

Active

1.0737 Gbit

64MX16

1.8 V

450 ps

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

105 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

TFBGA,

compliant

EAR99

8542.32.00.32

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Compare

MT47H64M16HR-3AT:G

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

350 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

unknown

EAR99

8542.32.00.32

MT47H64M16HR-3LAT:E

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

350 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

MT47H64M16HR-37ELAT:H

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

500 ps

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.32

MT47H64M16HR-37EAT:G

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

500 ps

267 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

330 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

MT47H64M16HR-3IT:E

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

350 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

unknown

EAR99

8542.32.00.32

MT47H64M16HR-37ELAT:G

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

500 ps

267 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

330 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

MT47H64M16HR-3ELAT:H

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

230 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

MT47H64M16HR-3AIT:H

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

230 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

AEC-Q100

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

MT47H64M16HR-3:E

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

350 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA84,9X15,32

not_compliant

EAR99

8542.32.00.32

MT47H64M16HR-3LAAT:H

Micron Technology Inc

Check for Price

Active

1.0737 Gbit

64MX16

1.8 V

450 ps

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

105 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

TFBGA,

compliant

EAR99

8542.32.00.32

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