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AM27C64-150DI
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP | DIP, DIP28,.6 | 28 | unknown | EAR99 | 8542.32.00.61 | ||||||||
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DM2764-20
LSI Corporation
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 200 ns | UVPROM | 21V PROGRAMMING VOLTAGE | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 21 V | 120 µA | 5.5 V | 4.5 V | NMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | SEEQ TECHNOLOGY INC | DIP, DIP28,.6 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||
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DE2764-45
LSI Corporation
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 450 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 21 V | 120 µA | CMOS | INDUSTRIAL | R-GDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | SEEQ TECHNOLOGY INC | DIP | DIP, DIP28,.6 | 28 | unknown | EAR99 | 8542.32.00.61 | |||||||||||
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8510203YA
Rochester Electronics LLC
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 200 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 140 µA | 30 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) - hot dipped | THROUGH-HOLE | 2.54 mm | DUAL | ROCHESTER ELECTRONICS LLC | DIP | DIP, DIP28,.6 | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||
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CY7C263-25WMB
Cypress Semiconductor
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 25 ns | UVPROM | POWER SWITCHED PROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 mA | 140 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T24 | Not Qualified | e0 | 1 | 125 °C | -55 °C | MIL-STD-883 | 24 | CERAMIC, GLASS-SEALED | WDIP | DIP24,.3 | RECTANGULAR | IN-LINE, WINDOW | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 31.877 mm | 7.62 mm | CYPRESS SEMICONDUCTOR CORP | DIP | 0.300 INCH, WINDOWED, CERDIP-24 | 24 | not_compliant | 3A001.A.2.C | 8542.32.00.61 | |||
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AM27C64-45LIB
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 45 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CQCC-N32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32(UNSPEC) | RECTANGULAR | CHIP CARRIER, WINDOW | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | WQCCN, LCC32(UNSPEC) | 32 | unknown | EAR99 | 8542.32.00.61 | |||||
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5962-8751509KA
Cypress Semiconductor
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Check for Price | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 45 ns | UVPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDFP-F24 | Not Qualified | e0 | 125 °C | -55 °C | 24 | CERAMIC, GLASS-SEALED | WDFP | RECTANGULAR | FLATPACK, WINDOW | YES | TIN LEAD | FLAT | 1.27 mm | DUAL | 2.54 mm | 15.367 mm | 9.652 mm | CYPRESS SEMICONDUCTOR CORP | DFP | WDFP, | 24 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||
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WS57C49B-45FMB
Waferscale Integration Inc
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 45 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 35 mA | 107 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDFP-F24 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 24 | CERAMIC, METAL-SEALED COFIRED | DFP | FL24,.4 | RECTANGULAR | FLATPACK | YES | TIN LEAD | FLAT | 1.27 mm | DUAL | WAFERSCALE INTEGRATION INC | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||||||
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MBM2764-25CV
FUJITSU Limited
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 250 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 21 V | 150 µA | MOS | COMMERCIAL | R-XQCC-N32 | Not Qualified | e0 | 70 °C | 32 | CERAMIC | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | FUJITSU LTD | QCCN, LCC32,.45X.55 | unknown | EAR99 | 8542.32.00.61 | ||||||||||||||
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AM27C64-255DI
e2v technologies
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Check for Price | Active | 65.536 kbit | 8 | 8KX8 | 5 V | 250 ns | UVPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.25 V | 4.75 V | CMOS | INDUSTRIAL | R-CDIP-T28 | 85 °C | -40 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | TELEDYNE E2V (UK) LTD | DIP-28 | compliant | EAR99 | 8542.32.00.61 |