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72825LB25PF
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 18.432 kbit | 18 | 1KX18 | 5 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | 1 | 1000 | 1.024 k | SYNCHRONOUS | YES | PARALLEL | 10 mA | 100 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQFP-G128 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 128 | PLASTIC/EPOXY | LFQFP | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | TQFP-128 | 128 | PK128 | not_compliant | EAR99 | 8542.32.00.71 | |||||||
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IDT72245LB25TFI8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 18 | 4KX18 | 5 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | 1 | 4000 | 4.096 k | SYNCHRONOUS | YES | PARALLEL | 5 mA | 60 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, STQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.71 | |||||||
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AM3P-67203V-55
Temic Semiconductors
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Check for Price | No | Obsolete | 18.432 kbit | 9 | 2KX9 | 5 V | 55 ns | 14.28 MHz | 70 ns | OTHER FIFO | 1 | 2000 | 2.048 k | ASYNCHRONOUS | NO | PARALLEL | 200 µA | 125 µA | CMOS | AUTOMOTIVE | R-PDIP-T28 | Not Qualified | e0 | 125 °C | -40 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | TEMIC SEMICONDUCTORS | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||||
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IDT72255LA20PFI9
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 147.456 kbit | 18 | 8KX18 | 5 V | 12 ns | 20 ns | RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, TQFP-64 | 64 | compliant | EAR99 | 8542.32.00.71 | |||||||||||||
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CMUI-67201AL-55
Atmel Corporation
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Check for Price | Obsolete | 4.608 kbit | 9 | 512X9 | 5 V | 55 ns | 70 ns | OTHER FIFO | 1 | 512 | 512 words | ASYNCHRONOUS | NO | PARALLEL | 70 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-J28 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | YES | J BEND | DUAL | ATMEL WIRELESS & MICROCONTROLLERS | SOJ | , | 28 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||||||||
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IDT72V3650L7-5BBGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 73.728 kbit | 36 | 2KX36 | 3.3 V | 5 ns | 133.3 MHz | 7.5 ns | OTHER FIFO | 1 | 2000 | 2.048 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 40 µA | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B144 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 144 | PLASTIC/EPOXY | BGA | BGA144,12X12,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.97 mm | 13 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA144,12X12,40 | 144 | compliant | EAR99 | 8542.32.00.71 | |||||||
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MMDP-67206FV-15/883
Atmel Corporation
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Check for Price | No | Transferred | 147.456 kbit | 9 | 16KX9 | 5 V | 15 ns | 25 ns | OTHER FIFO | 1 | 16000 | 16.384 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 120 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDFP-F28 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, METAL-SEALED COFIRED | DFP | FL28,.4 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 3.3 mm | 18.288 mm | 10.16 mm | ATMEL CORP | DFP | DFP, FL28,.4 | 28 | compliant | EAR99 | 8542.32.00.71 | |||||||||||
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IDT7202SA80XE
Integrated Device Technology Inc
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Check for Price | Obsolete | 9.216 kbit | 9 | 1KX9 | 5 V | 80 ns | 100 ns | RETRANSMIT | 1 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDFP-F28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC, GLASS-SEALED | DFP | RECTANGULAR | FLATPACK | YES | TIN LEAD | FLAT | 1.27 mm | DUAL | 2.921 mm | 18.288 mm | 12.446 mm | INTEGRATED DEVICE TECHNOLOGY INC | DFP | DFP, | 28 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||
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IDT72V2113L6BCG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 4 ns | 166 MHz | 6 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE | 9 | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B100 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, BGA100,10X10,40 | 100 | compliant | EAR99 | 8542.32.00.71 | ||||||
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IDT72V51336L6BB
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 589.824 kbit | 36 | 16KX36 | 3.3 V | 3.7 ns | 166 MHz | 6 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT | 1 | 16000 | 16.384 k | SYNCHRONOUS | YES | PARALLEL | 10 mA | 100 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 3.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA256,16X16,40 | 256 | not_compliant | EAR99 | 8542.32.00.71 |