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Manufacturer: Spansion
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S29GL128P10TFI010
Spansion
$3.1590 Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3 V 100 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL512P11TFI010
Spansion
$4.6435 Yes Yes Transferred 536.8709 Mbit 1 128K 512MX1 3 V 110 ns FLASH 8 YES YES YES 1 512 512000000 536.8709 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL256P10TFI010
Spansion
$6.9156 Yes Yes Transferred 268.4355 Mbit 16 128K 16MX16 3 V 100 ns FLASH 8 YES YES YES 1 256 16000000 16.7772 M ASYNCHRONOUS 3-STATE 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S70FL01GSAGBHIC10
Spansion
$9.0300 Transferred 1.0737 Gbit 8 128MX8 3 V 133 MHz FLASH 20 100000 Write/Erase Cycles 1 128000000 134.2177 M SYNCHRONOUS 3-STATE SERIAL 3 V QSPI 200 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PBGA-B24 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC BGA-24 unknown 3A991.B.1.A 8542.32.00.71
S29GL01GP11TFIR10
Spansion
$9.1523 Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3.3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL01GP12TFI010
Spansion
$22.8786 Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3 V 120 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL01GP11FFIR10
Spansion
$24.2760 Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3.3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 64 compliant 3A991.B.1.A 8542.32.00.51 Spansion
AM29F800BT-70EI
Spansion
$80.1324 No No Obsolete 8.3886 Mbit 16 16K,8K,32K,64K 512KX16 5 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES 1000000 Write/Erase Cycles 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS PARALLEL 5 V YES 1 mA 60 µA 5.5 V 4.5 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e0 3 85 °C -40 °C 260 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC TSOP1 MO-142DD, TSOP-48 48 not_compliant EAR99 8542.32.00.51
AM29LV008BT-90EI
Spansion
Check for Price No No Obsolete 8.3886 Mbit 8 16K,8K,32K,64K 1MX8 3 V 90 ns FLASH TOP BOOT BLOCK 1 TOP YES YES 20 1000000 Write/Erase Cycles 1 1,2,1,15 1000000 1.0486 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE 90 ns R-PDSO-G40 Not Qualified e0 3 85 °C -40 °C 260 40 PLASTIC/EPOXY TSSOP TSSOP40,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 10 mm SPANSION INC TSOP1 MO-142BCD, TSOP-40 40 not_compliant EAR99 8542.32.00.51
S25FL164K0XBHV033
Spansion
Check for Price Yes Transferred 67.1089 Mbit 8 8MX8 3 V 108 MHz FLASH ALSO CONFIGURABLE AS 64M X 1 2 20 100000 Write/Erase Cycles 1 8000000 8.3886 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 5 µA 25 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified e1 105 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,4X6,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC 8 X 6 MM, 1 MM PITCH, GREEN, BGA-24 compliant 3A991.B.1.A 8542.32.00.51