Findchips: Parametric Search Results for AM29SL400CT100WAD


Select Parts		Part Number

		AM29SL400CT-100RWBI AMD
		AM29SL400CT100REI AMD
		AM29SL400CT-100RWAC Spansion
		AM29SL400CT-100RWBC AMD
		AM29SL400CT100RWAI AMD
		AM29SL400CT100REI Spansion

			Most Relevant						Technical																						Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Data Polling	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

1.8 V

100 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

25 µA

2.2 V

1.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

1.8 V

100 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

25 µA

2.2 V

1.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP1

MO-142DD, TSOP-48

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

4.1943 Mbit

256KX16

1.8 V

100 ns

FLASH

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

2.2 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B48

Not Qualified

70 °C

240

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

TFBGA,

compliant

Check for Price

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

1.8 V

100 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

25 µA

2.2 V

1.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

1.8 V

100 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

25 µA

2.2 V

1.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

1.8 V

100 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

25 µA

2.2 V

1.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

MO-142DD, TSOP-48

not_compliant

EAR99

8542.32.00.51

Previous 1 2 3 4

Compare

AM29SL400CT-100RWBI

AMD

Check for Price

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

1.8 V

100 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

25 µA

2.2 V

1.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29SL400CT100REI

AMD

Check for Price

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

1.8 V

100 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

25 µA

2.2 V

1.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP1

MO-142DD, TSOP-48

unknown

EAR99

8542.32.00.51

AM29SL400CT-100RWAC

Spansion

Check for Price

Obsolete

4.1943 Mbit

256KX16

1.8 V

100 ns

FLASH

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

2.2 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B48

Not Qualified

70 °C

240

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

TFBGA,

compliant

AM29SL400CT-100RWBC

AMD

Check for Price

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

1.8 V

100 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

25 µA

2.2 V

1.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29SL400CT100RWAI

AMD

Check for Price

Yes

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

1.8 V

100 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

25 µA

2.2 V

1.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29SL400CT100REI

Spansion

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

1.8 V

100 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

25 µA

2.2 V

1.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

MO-142DD, TSOP-48

not_compliant

EAR99

8542.32.00.51

Previous 1 2 3 4

Parametric results for: AM29SL400CT100WAD under Flash Memories