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S29GL512P12TACR23
Spansion
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Check for Price | Transferred | 536.8709 Mbit | 1 | 512MX1 | 3.3 V | 120 ns | FLASH | 1 | 512000000 | 536.8709 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | OTHER | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | 56 | PLASTIC/EPOXY | HTSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | HTSSOP, | 56 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||||||||||||||
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GD25Q32CPJG
GigaDevice Semiconductor (Beijing) Inc
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Check for Price | Contact Manufacturer | 33.5544 Mbit | 1 | 32MX1 | 3.3 V | 120 MHz | FLASH | BOTTOM/TOP | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 5 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDIP-T8 | 105 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 3.88 mm | 9.27 mm | 7.62 mm | GIGADEVICE SEMICONDUCTOR INC | DIP-8 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||||||||
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SST25VF016B-50-4C-QAF
Silicon Storage Technology
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Check for Price | Yes | Transferred | 16 bit | 1 | 16X1 | 3 V | 50 MHz | FLASH | 100 | 100000 Write/Erase Cycles | 1 | 16 | 16 words | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | NOR TYPE | HARDWARE/SOFTWARE | R-XDSO-N8 | Not Qualified | e4 | 70 °C | 8 | UNSPECIFIED | VSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | SILICON STORAGE TECHNOLOGY INC | SON | VSON, SOLCC8,.25 | 8 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||||
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AT45DB641E-CCUN2B-T
Adesto Technologies Corporation
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Check for Price | Yes | Yes | Obsolete | 67.1089 Mbit | 1 | 64MX1 | 2.3 V | 85 MHz | FLASH | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 1.8 V | 3.6 V | 1.7 V | CMOS | INDUSTRIAL | S-PBGA-B9 | e1 | 3 | 85 °C | -40 °C | 9 | PLASTIC/EPOXY | VBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 600 µm | 6 mm | 6 mm | ADESTO TECHNOLOGIES CORP | BGA | 6 X 6 MM, 0.60 MM HEIGHT, 1 MM PITCH, GREEN, UBGA-9 | 9 | compliant | EAR99 | 8542.32.00.51 | Adesto Technologies | |||||||||||||||||||||||||
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S25FL016A0LMFI011
Spansion
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Check for Price | Yes | Yes | Obsolete | 16.7772 Mbit | 1 | 16MX1 | 3 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 5 µA | 28 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | S-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.159 mm | 5.283 mm | 5.283 mm | SPANSION INC | SOIC | SOP, SOP8,.3 | 8 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||
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AT25PE16-SHF-B
Adesto Technologies Corporation
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$2.4389 | Yes | Transferred | 16.7772 Mbit | 1 | 16MX1 | 3 V | 85 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 1.8 V | SPI | 50 µA | 18 µA | 3.6 V | 2.3 V | CMOS | INDUSTRIAL | HARDWARE/SOFTWARE | R-PDSO-G8 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.29 mm | 5.24 mm | ADESTO TECHNOLOGIES CORP | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Adesto Technologies | ||||||||||||||||||||||||
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QB25F016S33B8
Intel Corporation
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Check for Price | No | Transferred | 16.7772 Mbit | 1 | 16MX1 | 3 V | 68 MHz | FLASH | BOTTOM | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 70 µA | 45 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e0 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.159 mm | 5.23 mm | 5.23 mm | INTEL CORP | SOIC | SOP, SOP8,.3 | 8 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||||||||
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S29GL128P10FFI010
Infineon Technologies AG
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Check for Price | Yes | End Of Life | 134.2177 Mbit | 1 | 128K | 128MX1 | 3 V | 100 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | INFINEON TECHNOLOGIES AG | FBGA-64 | compliant | Infineon | ||||||||||||||
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W55F20
Winbond Electronics Corp
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Check for Price | Obsolete | 2.0972 Mbit | 1 | 2MX1 | 4.5 V | 1 MHz | FLASH | 10 | 10000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | SERIAL | 5 V | 4 µA | 10 µA | 5.5 V | 2.4 V | CMOS | COMMERCIAL | NOR TYPE | R-PDIP-T8 | Not Qualified | e3 | 70 °C | 8 | PLASTIC/EPOXY | DIP | DIP8(UNSPEC) | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | DUAL | WINBOND ELECTRONICS CORP | DIP | DIP, DIP8(UNSPEC) | 8 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||||||
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IS25WP016-JMLA1
Integrated Silicon Solution Inc
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Check for Price | Yes | Active | 16.7772 Mbit | 1 | 16MX1 | 1.8 V | FLASH | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 1.8 V | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | R-PDSO-G16 | 85 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | INTEGRATED SILICON SOLUTION INC | SOP, | compliant | EAR99 | 8542.32.00.51 |