Parametric results for: HT23C010 under MASK ROMs

Filter Your Search

1 - 10 of 10,038 results

|
-
-
-
-
-
-
-
-
-
-
-
-
Select parts from the table below to compare.
Compare
Compare
KM23C4000D-12
Samsung Semiconductor
Check for Price No Obsolete 4.1943 Mbit 8 512KX8 5 V 120 ns MASK ROM 1 512000 524.288 k ASYNCHRONOUS PARALLEL 50 µA 50 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.08 mm 41.91 mm 15.24 mm SAMSUNG SEMICONDUCTOR INC DIP DIP, DIP32,.6 32 unknown EAR99 8542.32.00.71
UPD23C64040ALGY-XXX-MJH
NEC Electronics Group
Check for Price Obsolete 4.1943 Mbit 8 512KX8 5 V 170 ns MASK ROM USER CONFIGURABLE AS 4M X 16 1 8000000 8.3886 M ASYNCHRONOUS PARALLEL 65 µA 5.5 V 4.5 V MOS COMMERCIAL R-PDSO-G48 Not Qualified 70 °C -10 °C 48 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 500 µm DUAL 1.2 mm 16.4 mm 12 mm NEC ELECTRONICS CORP TSOP1 TSOP1, 48 unknown EAR99 8542.32.00.71
KM23C64000BT-10
Samsung Semiconductor
Check for Price No Obsolete 67.1089 Mbit 16 4MX16 5 V 100 ns MASK ROM CONFIGURABLE AS 4M X 16 8 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 100 µA 70 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G44 Not Qualified e0 70 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm SAMSUNG SEMICONDUCTOR INC TSOP2 TSOP2, TSOP44,.46,32 44 unknown EAR99 8542.32.00.71
AKN62344BP
Asahi Kasei Microsystems Corporation
Check for Price No Active 4.1943 Mbit 16 256KX16 5 V 250 ns MASK ROM CARD 1 512000 524.288 k ASYNCHRONOUS PARALLEL 30 µA 60 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY DIP DIP32,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL ASAHI KASEI MICRODEVICES CORP unknown EAR99 8542.32.00.71
GM23V16000A-15
LG Semicon Co Ltd
Check for Price No Transferred 16.7772 Mbit 16 1MX16 150 ns MASK ROM 8 1000000 1.0486 M 50 µA 30 µA CMOS COMMERCIAL R-PDIP-T42 Not Qualified e0 70 °C 42 PLASTIC/EPOXY DIP DIP42,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL LG SEMICON CO LTD unknown EAR99 8542.32.00.71
KM23257J-15
Samsung Semiconductor
Check for Price No No Obsolete 262.144 kbit 8 32KX8 5 V 150 ns MASK ROM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 75 µA MOS COMMERCIAL S-PQCC-J28 Not Qualified e0 3 70 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD SAMSUNG SEMICONDUCTOR INC QCCJ, LDCC28,.5SQ unknown EAR99 8542.32.00.71
S-204000CRC-200
ABLIC Inc.
Check for Price Obsolete 4.1943 Mbit 8 512KX8 5 V 200 ns MASK ROM 1 512000 524.288 k ASYNCHRONOUS PARALLEL 100 µA 50 µA CMOS COMMERCIAL Not Qualified 70 °C DIE OR CHIP SEIKO INSTRUMENTS USA INC , DIE OR CHIP compliant EAR99 8542.32.00.71
MX23L6414TI-12
Macronix International Co Ltd
Check for Price No Obsolete 67.1089 Mbit 16 4MX16 3 V 120 ns MASK ROM CAN ALSO BE CONFIGURED AS 8M X 8 8 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 20 µA 3.6 V 2.7 V CMOS OTHER R-PDSO-G56 Not Qualified e0 85 °C -25 °C 56 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm MACRONIX INTERNATIONAL CO LTD TSOP TSSOP, 56 unknown EAR99 8542.32.00.71
MB832000-20P
FUJITSU Limited
Check for Price Obsolete 32.768 kbit 8 4KX8 5 V 175 ns MASK ROM 1 256000 262.144 k ASYNCHRONOUS PARALLEL 40 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T32 Not Qualified 70 °C 32 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5 mm 40.44 mm 15.24 mm FUJITSU SEMICONDUCTOR AMERICA INC DIP DIP, 32 unknown EAR99 8542.32.00.71
KM23C8000G-15
Samsung Semiconductor
Check for Price No No Obsolete 8.3886 Mbit 8 1MX8 5 V 150 ns MASK ROM 1 1000000 1.0486 M ASYNCHRONOUS 3-STATE PARALLEL 50 µA 50 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY SOP SOP32,.56 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 3 mm 20.47 mm 11.43 mm SAMSUNG SEMICONDUCTOR INC SOIC SOP, SOP32,.56 32 unknown EAR99 8542.32.00.71