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KM23C4000D-12
Samsung Semiconductor
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Check for Price | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 120 ns | MASK ROM | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 41.91 mm | 15.24 mm | SAMSUNG SEMICONDUCTOR INC | DIP | DIP, DIP32,.6 | 32 | unknown | EAR99 | 8542.32.00.71 | ||||||||
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UPD23C64040ALGY-XXX-MJH
NEC Electronics Group
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Check for Price | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 170 ns | MASK ROM | USER CONFIGURABLE AS 4M X 16 | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 65 µA | 5.5 V | 4.5 V | MOS | COMMERCIAL | R-PDSO-G48 | Not Qualified | 70 °C | -10 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 16.4 mm | 12 mm | NEC ELECTRONICS CORP | TSOP1 | TSOP1, | 48 | unknown | EAR99 | 8542.32.00.71 | |||||||||||
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KM23C64000BT-10
Samsung Semiconductor
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Check for Price | No | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 5 V | 100 ns | MASK ROM | CONFIGURABLE AS 4M X 16 | 8 | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 100 µA | 70 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e0 | 70 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSOP2, TSOP44,.46,32 | 44 | unknown | EAR99 | 8542.32.00.71 | ||||||
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AKN62344BP
Asahi Kasei Microsystems Corporation
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Check for Price | No | Active | 4.1943 Mbit | 16 | 256KX16 | 5 V | 250 ns | MASK ROM CARD | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 30 µA | 60 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ASAHI KASEI MICRODEVICES CORP | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||
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GM23V16000A-15
LG Semicon Co Ltd
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Check for Price | No | Transferred | 16.7772 Mbit | 16 | 1MX16 | 150 ns | MASK ROM | 8 | 1000000 | 1.0486 M | 50 µA | 30 µA | CMOS | COMMERCIAL | R-PDIP-T42 | Not Qualified | e0 | 70 °C | 42 | PLASTIC/EPOXY | DIP | DIP42,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | LG SEMICON CO LTD | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||||
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KM23257J-15
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | MASK ROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 75 µA | MOS | COMMERCIAL | S-PQCC-J28 | Not Qualified | e0 | 3 | 70 °C | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | SAMSUNG SEMICONDUCTOR INC | QCCJ, LDCC28,.5SQ | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||
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S-204000CRC-200
ABLIC Inc.
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Check for Price | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 200 ns | MASK ROM | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 100 µA | 50 µA | CMOS | COMMERCIAL | Not Qualified | 70 °C | DIE OR CHIP | SEIKO INSTRUMENTS USA INC | , DIE OR CHIP | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||||||||
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MX23L6414TI-12
Macronix International Co Ltd
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Check for Price | No | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 3 V | 120 ns | MASK ROM | CAN ALSO BE CONFIGURED AS 8M X 8 | 8 | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 20 µA | 3.6 V | 2.7 V | CMOS | OTHER | R-PDSO-G56 | Not Qualified | e0 | 85 °C | -25 °C | 56 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | MACRONIX INTERNATIONAL CO LTD | TSOP | TSSOP, | 56 | unknown | EAR99 | 8542.32.00.71 | |||||||
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MB832000-20P
FUJITSU Limited
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Check for Price | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 175 ns | MASK ROM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 40 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | 70 °C | 32 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5 mm | 40.44 mm | 15.24 mm | FUJITSU SEMICONDUCTOR AMERICA INC | DIP | DIP, | 32 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||
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KM23C8000G-15
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 5 V | 150 ns | MASK ROM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | SOP | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3 mm | 20.47 mm | 11.43 mm | SAMSUNG SEMICONDUCTOR INC | SOIC | SOP, SOP32,.56 | 32 | unknown | EAR99 | 8542.32.00.71 |