Parametric results for: Other Memory ICs

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MB84VD21081EA-70-PBS
FUJITSU Semiconductor Limited
Check for Price No No Active 16.7772 Mbit 16 1MX16 3 V MEMORY CIRCUIT 128K X 16 SRAM ALSO AVAILABLE 1 1000000 1.0486 M ASYNCHRONOUS 3.3 V 2.7 V CMOS INDUSTRIAL R-PBGA-B56 Not Qualified e0 85 °C -40 °C 56 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 7.2 mm 7 mm FUJITSU LTD BGA TFBGA, 56 compliant EAR99 8542.32.00.71
S71JL064H80BFW013
AMD
Check for Price Yes Transferred 67.1089 Mbit 16 4MX16 3 V 70 ns MEMORY CIRCUIT SRAM IS ORGANIZED AS 512K X 16 / 1M X 8; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 FLASH+SRAM 1 4000000 4.1943 M ASYNCHRONOUS 45 µA 3.3 V 2.7 V CMOS OTHER R-PBGA-B73 Not Qualified e1 3 85 °C -25 °C 73 PLASTIC/EPOXY LFBGA BGA73,10X12,32 RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 11.6 mm 8 mm ADVANCED MICRO DEVICES INC BGA LFBGA, BGA73,10X12,32 73 compliant EAR99 8542.32.00.71
S71JL064HF0BFI022
Spansion
Check for Price Obsolete 67.1089 Mbit 16 4MX16 3 V MEMORY CIRCUIT STATIC RAM IS ORGANIZED AS 1M X 16 1 4000000 4.1943 M ASYNCHRONOUS 3.3 V 2.7 V CMOS INDUSTRIAL R-PBGA-B73 Not Qualified 85 °C -40 °C 73 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.4 mm 11.6 mm 8 mm SPANSION INC BGA LFBGA, 73 unknown EAR99 8542.32.00.71
IS71V16F32FS08-7070BI
Integrated Silicon Solution Inc
Check for Price No No Obsolete 33.5544 Mbit 16 2MX16 3 V 70 ns MEMORY CIRCUIT ALSO CONTAINS 512K X 16/1M X 8 SRAM FLASH+SRAM 1 2000000 2.0972 M ASYNCHRONOUS 5 µA 53 µA 3.3 V 2.7 V CMOS INDUSTRIAL R-PBGA-B73 Not Qualified e0 85 °C -40 °C 73 PLASTIC/EPOXY LFBGA BGA73,10X12,32 RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.4 mm 11.6 mm 8 mm INTEGRATED SILICON SOLUTION INC BGA 8 X 11.60 MM, 0.80 MM PITCH, MINI, BGA-73 73 compliant EAR99 8542.32.00.71
K5A3340YBC-T7550
Samsung Semiconductor
Check for Price Obsolete 33.5544 Mbit 16 2MX16 3 V MEMORY CIRCUIT SRAM IS ORGANIZED AS 512K X 8 / 256K X 1... more 1 2000000 2.0972 M ASYNCHRONOUS 3.3 V 2.7 V CMOS INDUSTRIAL R-PBGA-B69 Not Qualified 85 °C -40 °C 69 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 11 mm 8 mm SAMSUNG SEMICONDUCTOR INC BGA TFBGA, 69 unknown EAR99 8542.32.00.71
S72XS256RE0AHBH23
Cypress Semiconductor
Check for Price Transferred 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT 1 16000000 16.7772 M SYNCHRONOUS 1.95 V 1.7 V CMOS INDUSTRIAL S-PBGA-B133 85 °C -40 °C 133 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 1 mm 8 mm 8 mm CYPRESS SEMICONDUCTOR CORP BGA-133 compliant EAR99 8542.32.00.71
MT28C256564W18SBT-F705P85TBWT
Micron Technology Inc
Check for Price Obsolete 134.2177 Mbit 16 8MX16 MEMORY CIRCUIT CELLULARRAM IS ORGANIZED AS 4M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH 1 8000000 8.3886 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B88 Not Qualified e1 85 °C -25 °C 88 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 12 mm 9 mm MICRON TECHNOLOGY INC BGA LFBGA, 88 unknown EAR99 8542.32.00.71
RD58F0012LVYBB0
Intel Corporation
Check for Price No Obsolete 268.4355 Mbit 16 16MX16 1.8 V 85 ns MEMORY CIRCUIT LPSDRAM IS ORGANIZED AS 128MBIT; ALSO CO... more FLASH+SDRAM 1 16000000 16.7772 M ASYNCHRONOUS 5 mA 60 µA 2 V 1.7 V CMOS OTHER R-PBGA-B103 Not Qualified e0 85 °C -25 °C 103 PLASTIC/EPOXY LFBGA BGA103,9X12,32 RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.4 mm 11 mm 9 mm INTEL CORP BGA LFBGA, BGA103,9X12,32 103 compliant EAR99 8542.32.00.71
MT28C128516W18DBW-F706P70KTTWT
Micron Technology Inc
Check for Price Yes Yes Obsolete 67.1089 Mbit 16 4MX16 MEMORY CIRCUIT CELLULARRAM IS ORGANIZED AS 1M X 16; CONTAINS ADDITIONAL 4M X 16 FLASH 1 4000000 4.1943 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B77 Not Qualified e1 85 °C -25 °C 77 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 10 mm 8 mm MICRON TECHNOLOGY INC BGA LFBGA, 77 compliant EAR99 8542.32.00.71
MB84VD22290FE-70PBS-E1
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 2MX16 3 V MEMORY CIRCUIT SRAM IS ORGANIZED AS 512K X 16 1 2000000 2.0972 M ASYNCHRONOUS 3.1 V 2.7 V CMOS OTHER R-PBGA-B59 Not Qualified e1 85 °C -30 °C 59 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC BGA TFBGA, 59 compliant EAR99 8542.32.00.71