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STK14C88-K35I
Simtek Corporation
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 35 ns | NON-VOLATILE SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 1.5 mA | 85 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CDIP-T32 | Not Qualified | e0 | 85 °C | -40 °C | 240 | 32 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP32,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.12 mm | 40.635 mm | 7.62 mm | SIMTEK CORP | DIP, DIP32,.3 | unknown | EAR99 | 8542.32.00.41 | |||||||||||||
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IDT70927L20PF8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 524.288 kbit | 16 | 32KX16 | 5 V | 20 ns | MULTI-PORT SRAM | 1 | 32000 | 32.768 k | SYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G100 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | LFQFP, | compliant | 3A991.B.2.B | 8542.32.00.41 | QFP | 100 | ||||||||||||
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IDT71V2556SA100BGG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 5 ns | ZBT SRAM | PIPELINED ARCHITECTURE | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 70 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA, | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 119 | |||||||||||||
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IS64VPS409618B-200TQ2A3
Integrated Silicon Solution Inc
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Check for Price | Obsolete | 75.4975 Mbit | 18 | 4MX18 | 2.5 V | 3.1 ns | STANDARD SRAM | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | PARALLEL | 2.625 V | 2.375 V | CMOS | AUTOMOTIVE | R-PQFP-G100 | 125 °C | -40 °C | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | LQFP, | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||||||||
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CY62167G18-55ZXIT
Cypress Semiconductor
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$13.0410 | Yes | Yes | Transferred | 16.7772 Mbit | 16 | 1MX16 | 1.8 V | 55 ns | STANDARD SRAM | 8 | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 2.2 V | 1.65 V | CMOS | INDUSTRIAL | R-PDSO-G48 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | PURE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | CYPRESS SEMICONDUCTOR CORP | TSOP1-48 | compliant | 3A991.B.2.A | 8542.32.00.41 | 2017-05-26 | ||||||||||||||
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GS8182S08BGD-167IT
GSI Technology
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Check for Price | Yes | Yes | Active | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 500 ps | DDR SRAM | PIPELINED ARCHITECTURE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | PARALLEL | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 165 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | GSI TECHNOLOGY | LBGA, | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 165 | |||||||||||
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IDT709179L7PFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 294.912 kbit | 9 | 32KX9 | 5 V | 18 ns | MULTI-PORT SRAM | 1 | 32000 | 32.768 k | SYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP-100 | compliant | 3A991.B.2.B | 8542.32.00.41 | QFP | 100 | ||||||||||||
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MMCI-65656L55/883
Atmel Corporation
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | STANDARD SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | 125 °C | -55 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 4.83 mm | 35.555 mm | 15.24 mm | ATMEL CORP | DIP, | unknown | 3A001.A.2.C | 8542.32.00.41 | DIP | 28 | ||||||||||||||||||
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GS820E32Q-6IT
GSI Technology
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Check for Price | No | No | Obsolete | 2.0972 Mbit | 32 | 64KX32 | 3.3 V | 18 ns | CACHE SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 1 | 64000 | 65.536 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | YES | GULL WING | 650 µm | QUAD | 3.35 mm | 20 mm | 14 mm | GSI TECHNOLOGY | QFP, | compliant | 3A991.B.2.A | 8542.32.00.41 | QFP | 100 | |||||||||||||
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MSM8128WI-020
APTA Group Inc
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 20 ns | STANDARD SRAM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 mA | 4.5 V | 175 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CQCC-N32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 2.414 mm | 17.78 mm | 11.43 mm | APTA GROUP INC | QCCN, LCC32,.45X.55 | unknown | 3A991.B.2.B | 8542.32.00.41 | QFJ | 32 |