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DSPIC33FJ09GS302T-E/SS
Microchip Technology Inc
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Check for Price | Yes | Active | 16 | 512 | 40 MHz | YES | 3.3 V | DIGITAL SIGNAL PROCESSOR, CONTROLLER | CMOS | YES | YES | FIXED POINT | MULTIPLE | YES | 125 mA | 3.6 V | 3 V | AUTOMOTIVE | R-PDSO-G28 | Not Qualified | 125 °C | -40 °C | AEC-Q100; TS 16949 | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | GULL WING | 650 µm | DUAL | 2 mm | 5.3 mm | 10.2 mm | MICROCHIP TECHNOLOGY INC | SSOP-28 | compliant | 3A991.A.2 | 8542.31.00.01 | |||||||||||||||||||||||||||||
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TMS320C6421ZWT4
Texas Instruments
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$11.6762 | Yes | Yes | Active | 32 | 49152 | 8 | 22 | 400 MHz | 5 | YES | 1.2 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT 350MHZ | NO | YES | FIXED POINT | YES | MULTIPLE | NO | 72 | 8 | 8 | MROM | 1.26 V | 1.14 V | COMMERCIAL | S-PBGA-B361 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 361 | PLASTIC/EPOXY | LFBGA | BGA361,19X19,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 16 mm | 16 mm | TEXAS INSTRUMENTS INC | NFBGA-361 | compliant | 3A991.A.2 | 8542.31.00.01 | BGA | 361 | |||||||||||||||
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UPD77017GC-XXX-9EU
Renesas Electronics Corporation
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Check for Price | Obsolete | RENESAS ELECTRONICS CORP | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TMX320TCI6602XCYP5
Texas Instruments
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Check for Price | Obsolete | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | TEXAS INSTRUMENTS INC | , | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TYCOF2812PGFA
Texas Instruments
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$21.3180 | Yes | Active | 32 | 9216 | 16 | 19 | 150 MHz | 8 | YES | 1.9 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | ALSO OPERATES AT 1.8V SUPPLY | NO | YES | FIXED POINT | NO | MULTIPLE | YES | 3 | 16 | 16 | OTPROM | 230 mA | 2 V | 1.81 V | INDUSTRIAL | S-PQFP-G176 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 176 | PLASTIC/EPOXY | LFQFP | QFP176,1.0SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | QUAD | 1.6 mm | 24 mm | 24 mm | TEXAS INSTRUMENTS INC | LFQFP, QFP176,1.0SQ,20 | compliant | 3A991.A.2 | 8542.31.00.01 | QFP | 176 | Texas Instruments | |||||||||||||
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WEDSP32C-80RL(ROMLESS-VER)
LSI Corporation
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Check for Price | Obsolete | 768 | 32 | 24 | 50 MHz | NO | 5 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | 2 EXECUTION UNITS; SINGLE CYCLE INSTRUCT... more | NO | NO | FLOATING POINT | NO | SINGLE | NO | 2 | 1 | 32 | 225 mA | 5.25 V | 4.75 V | INDUSTRIAL | S-CPGA-P133 | Not Qualified | 85 °C | -40 °C | 133 | CERAMIC, METAL-SEALED COFIRED | SQUARE | GRID ARRAY | PIN/PEG | PERPENDICULAR | AT & T MICROELECTRONICS | , | unknown | 3A991.A.2 | 8542.31.00.01 | |||||||||||||||||||||||||||||||
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DSP56652
Motorola Mobility LLC
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Check for Price | Obsolete | 16 | 22 | 58.8 MHz | YES | 2.5 V | DIGITAL SIGNAL PROCESSOR, MIXED | CMOS | YES | YES | FIXED POINT | MULTIPLE | YES | 2.5 V | 1.8 V | INDUSTRIAL | S-PBGA-B196 | Not Qualified | 85 °C | -40 °C | 196 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | BALL | BOTTOM | MOTOROLA INC | BGA, | unknown | 3A991.A.2 | 8542.31.00.01 | BGA | 196 | |||||||||||||||||||||||||||||||||||
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DSPIC33FJ16GS502T-50H/MX
Microchip Technology Inc
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Check for Price | No | Active | 16 | 2048 | 3 | YES | 3.3 V | DIGITAL SIGNAL PROCESSOR, CONTROLLER | CMOS | YES | YES | FIXED POINT | NO | MULTIPLE | YES | 3 | 8 | 8 | FLASH | 3.6 V | 3 V | AUTOMOTIVE | S-PQCC-N28 | 150 °C | -40 °C | AEC-Q100; TS 16949 | 28 | PLASTIC/EPOXY | HVQCCN | LCC28,.24SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | NO LEAD | 650 µm | QUAD | 600 µm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | UQFN-28 | compliant | 3A001.A.2.A | 8542.31.00.01 | ||||||||||||||||||||||||||
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TMS320C6203GJL-200
Texas Instruments
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Check for Price | Obsolete | 32 | 22 | 200 MHz | YES | 1.5 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | NO | YES | FIXED POINT | MULTIPLE | YES | 1.575 V | 1.425 V | OTHER | S-PBGA-B352 | Not Qualified | 90 °C | 352 | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 3.8 mm | 27 mm | 27 mm | TEXAS INSTRUMENTS INC | HBGA, | unknown | 3A991.A.2 | 8542.31.00.01 | BGA | 352 | ||||||||||||||||||||||||||||||||
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DSPIC33FJ06GS202-E/SO
Microchip Technology Inc
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$3.7260 | Yes | Yes | Active | 16 | 40 MHz | 1024 | 40 MHz | 21 | 4 | YES | 3.3 V | DIGITAL SIGNAL PROCESSOR, CONTROLLER | CMOS | YES | YES | YES | NO | FIXED POINT | YES | NO | MULTIPLE | YES | 3 | 1 | 8 | 24 | YES | FLASH | 160 mA | 3.6 V | 3 V | AUTOMOTIVE | R-PDSO-G28 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | AEC-Q100; TS 16949 | 40 | 28 | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.65 mm | 7.5 mm | 17.9 mm | MICROCHIP TECHNOLOGY INC | SOIC-28 | compliant | 3A991.A.2 | 8542.31.00.01 | SOIC | 28 | Microchip |