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XCZU3EG-2LSFVC784I
AMD Xilinx
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Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | INDUSTRIAL | S-PBGA-B784 | e1 | 4 | 100 °C | -40 °C | 250 | 30 | 784 | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 3.32 mm | 23 mm | 23 mm | XILINX INC | , | compliant | 8542.31.00.01 | ||||||
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XCZU2CG-2LSBVA484E
AMD Xilinx
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Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | OTHER | S-PBGA-B484 | e1 | 4 | 110 °C | 250 | 30 | 484 | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 2.61 mm | 19 mm | 19 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||||||
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XCZU6CG-2LFFVC900E
AMD Xilinx
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Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | OTHER | S-PBGA-B900 | e1 | 4 | 110 °C | 245 | 30 | 900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.42 mm | 31 mm | 31 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||||||
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XCZU17EG-1LFFVD1760I
AMD Xilinx
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Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | INDUSTRIAL | S-PBGA-B1760 | e1 | 4 | 100 °C | -40 °C | 245 | 30 | 1760 | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.71 mm | 42.5 mm | 42.5 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | ||||||
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XCZU2CG-1LSBVA484I
AMD Xilinx
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Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | INDUSTRIAL | S-PBGA-B484 | e1 | 4 | 100 °C | -40 °C | 250 | 30 | 484 | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 2.61 mm | 19 mm | 19 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | ||||||
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XCZU5EG-1SFVC784I
AMD Xilinx
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$1,693.9000 | Yes | Transferred | YES | 850 mV | PROGRAMMABLE SoC | CMOS | 876 mV | 825 mV | INDUSTRIAL | R-PBGA-B784 | e1 | 4 | 100 °C | -40 °C | 250 | 30 | 784 | PLASTIC/EPOXY | BGA | BGA784,28X28,32 | RECTANGULAR | GRID ARRAY | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 3.32 mm | 23 mm | 23 mm | XILINX INC | FCBGA-784 | compliant | 8542.39.00.01 | 5A002.A.4 | ||||
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AM2432BSFFGIALXR
Texas Instruments
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Check for Price | No | Obsolete | YES | 850 mV | SoC | CMOS | 895 mV | 810 mV | S-PBGA-B293 | 125 °C | -40 °C | 293 | PLASTIC/EPOXY | VFBGA | BGA293,21X21,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1 mm | 11 mm | 11 mm | |||||||||||||||
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XCZU4EG-1LSFVC784I
AMD Xilinx
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Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | INDUSTRIAL | S-PBGA-B784 | e1 | 4 | 100 °C | -40 °C | 250 | 30 | 784 | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 3.32 mm | 23 mm | 23 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | ||||||
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AM2434BSDFGIALXR
Texas Instruments
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Check for Price | No | Obsolete | YES | 850 mV | SoC | CMOS | 895 mV | 810 mV | S-PBGA-B293 | 125 °C | -40 °C | 293 | PLASTIC/EPOXY | VFBGA | BGA293,21X21,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1 mm | 11 mm | 11 mm | |||||||||||||||
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XCZU3CG-2LSBVA484I
AMD Xilinx
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Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | INDUSTRIAL | S-PBGA-B484 | 100 °C | -40 °C | 484 | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2.61 mm | 19 mm | 19 mm | XILINX INC | , | compliant | 8542.31.00.01 |