Parametric results for: L64500AGMC under Microprocessors

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MCIMX6X2EVN10ABR
NXP Semiconductors
$1.0000 Yes Not Recommended 32 800 MHz YES MICROPROCESSOR, RISC CMOS S-PBGA-B400 e1 3 260 40 400 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.27 mm 17 mm 17 mm MAPBGA-400 5A992.C 8542.31.00.01 2017-03-27
MCF5234CVM100
NXP Semiconductors
$1.0000 Yes Not Recommended 32 100 MHz 32 24 75 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS LOW POWER MODE TAKEN FROM LOW POWER MODE YES FIXED POINT YES YES 1.6 V 1.4 V INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 260 40 256 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.6 mm 17 mm 17 mm ROHS COMPLIANT, MAPBGA-256 3A991.A.2 8542.31.00.01
MCIMX31LCVKN5DR2
NXP Semiconductors
$1.0000 Yes Active YES SoC INDUSTRIAL S-PBGA-B457 Not Qualified e1 3 85 °C -40 °C 260 40 457 PLASTIC/EPOXY FBGA BGA457,26X26,20 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 5A992.C 8542.31.00.01
package
ATSAMA5D35A-CNR
Microchip Technology Inc
$1.0000 Yes Yes Active 32 536 MHz 131072 16 26 48 MHz YES 1.2 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 39 1 10 8 1.32 V 1.08 V INDUSTRIAL S-PBGA-B324 Not Qualified e1 105 °C -40 °C 324 PLASTIC/EPOXY LFBGA BGA324,18X18,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm 5A992.C 8542.31.00.01 324 LFBGA-324
MCF5233CVM100
NXP Semiconductors
$1.0000 Yes Not Recommended 32 100 MHz 32 24 75 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS LOW POWER MODE TAKEN FROM LOW POWER MODE YES FIXED POINT YES YES 1.6 V 1.4 V INDUSTRIAL S-PBGA-B256 Not Qualified 3 85 °C -40 °C 260 40 256 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.6 mm 17 mm 17 mm ROHS COMPLIANT, MAPBGA-256 3A991.A.2 8542.31.00.01
MCF5481CVR166
NXP Semiconductors
$1.0000 Yes Not Recommended 32 166.66 MHz 66.67 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 3.6 V 3 V INDUSTRIAL S-PBGA-B388 Not Qualified e1 3 85 °C -40 °C 260 40 388 PLASTIC/EPOXY BGA SQUARE GRID ARRAY Nickel/Gold (Ni/Au) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388 5A002.A.1 8542.31.00.01
MCF5249CVM140
NXP Semiconductors
$1.0000 Yes Obsolete 32 140 MHz 16 24 33.86 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS REQUIRES 3.3V SUPPLY FOR I/O YES FIXED POINT YES YES S-PBGA-B160 Not Qualified e1 3 260 40 160 PLASTIC/EPOXY BGA SQUARE GRID ARRAY Nickel/Gold (Ni/Au) BALL 1 mm BOTTOM 1.75 mm 15 mm 15 mm 15 X 15 MM, 1 MM PITCH, MAPBGA-160 3A991.A.2 8542.31.00.01
MCF54455CVP200
NXP Semiconductors
$1.0000 Yes Not Recommended MICROPROCESSOR 3 260 40 Tin/Silver (Sn/Ag) 3A991.A.2 8542.31.00.01
MCF5235CVM150
NXP Semiconductors
$1.0000 Yes Not Recommended 32 150 MHz 32 24 75 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS LOW POWER MODE TAKEN FROM LOW POWER MODE YES FIXED POINT YES YES 1.6 V 1.4 V INDUSTRIAL S-PBGA-B256 Not Qualified 3 85 °C -40 °C 260 40 256 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.6 mm 17 mm 17 mm ROHS COMPLIANT, MAPBGA-256 5A002.A.1 8542.31.00.01
MPC8314CVRAFDA
NXP Semiconductors
$1.0000 Yes Not Recommended 32 333 MHz 66.67 MHz YES 1 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B620 Not Qualified e2 3 105 °C -40 °C 260 40 620 PLASTIC/EPOXY HBGA BGA620,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Nickel/Gold (Ni/Au) BALL 1 mm BOTTOM 2.46 mm 29 mm 29 mm 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 3A991.A.2 8542.31.00.01