Parametric results for: Parallel IO Ports

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MAX7326AEG+
Maxim Integrated Products
$2.1971 Yes Yes Transferred YES 3.3 V PARALLEL IO PORT, GENERAL PURPOSE BICMOS 1 5.5 V 1.71 V AUTOMOTIVE R-PDSO-G24 Not Qualified e3 1 125 °C -40 °C 260 30 24 PLASTIC/EPOXY SSOP SSOP24,.24 RECTANGULAR SMALL OUTLINE, SHRINK PITCH MATTE TIN GULL WING 635 µm DUAL 1.75 mm 3.9 mm 8.65 mm MAXIM INTEGRATED PRODUCTS INC SSOP 0.150 INCH, 0.025 INCH PITCH, LEAD FREE, MO-137AE, QSOP-24 24 compliant EAR99 8542.39.00.01
N8X470I
Philips Semiconductors
Check for Price No Obsolete 16 2 NO 5 V PARALLEL IO PORT, GENERAL PURPOSE 2 5.25 V 4.75 V COMMERCIAL R-XDIP-T24 Not Qualified e0 70 °C 24 CERAMIC DIP DIP24,.4 RECTANGULAR IN-LINE Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL PHILIPS SEMICONDUCTORS DIP, DIP24,.4 unknown EAR99 8542.39.00.01
N8X470N
Philips Semiconductors
Check for Price No Obsolete 16 2 NO 5 V PARALLEL IO PORT, GENERAL PURPOSE 2 5.25 V 4.75 V COMMERCIAL R-PDIP-T24 Not Qualified e0 70 °C 24 PLASTIC/EPOXY DIP DIP24,.4 RECTANGULAR IN-LINE Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL PHILIPS SEMICONDUCTORS DIP, DIP24,.4 unknown EAR99 8542.39.00.01
SSI34B580-P
Silicon Systems Inc
Check for Price No Obsolete 4 NO 5 V PARALLEL IO PORT, GENERAL PURPOSE BIPOLAR 1 5.25 V 4.75 V COMMERCIAL R-PDIP-T28 Not Qualified e0 70 °C 28 PLASTIC/EPOXY DIP DIP28,.6 RECTANGULAR IN-LINE Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL SILICON SYSTEMS INC DIP, DIP28,.6 unknown EAR99 8542.39.00.01
SSI580CD
Silicon Systems Inc
Check for Price No Obsolete 4 NO 5 V PARALLEL IO PORT, GENERAL PURPOSE BIPOLAR 1 5.25 V 4.75 V COMMERCIAL R-XDIP-T28 Not Qualified e0 70 °C 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL SILICON SYSTEMS INC DIP, DIP28,.6 unknown EAR99 8542.39.00.01
MAX7322AEE-T
Maxim Integrated Products
Check for Price No No Obsolete 4 YES 5 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 8 5.5 V 2.7 V AUTOMOTIVE R-PDSO-G16 Not Qualified e0 125 °C -40 °C 16 PLASTIC/EPOXY SSOP SSOP16,.25 RECTANGULAR SMALL OUTLINE, SHRINK PITCH TIN LEAD GULL WING 635 µm DUAL 1.75 mm 3.9 mm 4.89 mm MAXIM INTEGRATED PRODUCTS INC SOIC 0.150 INCH, 0.250 INCH LEAD PITCH, LEAD FREE, PLASTIC QSOP-16 16 not_compliant EAR99 8542.39.00.01
MAX7322ATE-T
Maxim Integrated Products
Check for Price No No Obsolete 4 YES 5 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 8 5.5 V 2.7 V AUTOMOTIVE S-PQCC-N16 Not Qualified e0 125 °C -40 °C 16 PLASTIC/EPOXY HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TIN LEAD NO LEAD 500 µm QUAD 800 µm 3 mm 3 mm MAXIM INTEGRATED PRODUCTS INC QFN 3 X 3 MM, 0.80 MM HEIGHT, LEADFREE, PLASTIC, TQFN-16 16 not_compliant EAR99 8542.39.00.01
MAX7323ATE+
Analog Devices Inc
Check for Price Yes Active 8 4 YES 3.3 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 1 5.5 V 1.71 V AUTOMOTIVE S-XQCC-N16 Not Qualified e3 1 125 °C -40 °C 260 30 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 800 µm 3 mm 3 mm ANALOG DEVICES INC 16-LFCSP-3X3X0.75 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 16 compliant 16-LFCSP-3X3X0.75 2007-09-18 Analog Devices
935277495118
NXP Semiconductors
Check for Price Obsolete 400 kHz 4 YES 3 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 1 5.5 V 2.3 V INDUSTRIAL S-PDSO-G10 85 °C -40 °C 10 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GULL WING 500 µm DUAL 1.1 mm 3 mm 3 mm NXP SEMICONDUCTORS TSSOP, unknown EAR99 8542.39.00.01
MAX7323ATE+T
Analog Devices Inc
Check for Price Yes Active 4 YES 3.3 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 1 5.5 V 1.71 V AUTOMOTIVE S-XQCC-N16 Not Qualified e3 1 125 °C -40 °C 260 30 16 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 800 µm 3 mm 3 mm ANALOG DEVICES INC 16-LFCSP-3X3X0.75 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 16 compliant 16-LFCSP-3X3X0.75 2007-09-18 Analog Devices