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MAX7326AEG+
Maxim Integrated Products
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$2.1971 | Yes | Yes | Transferred | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | BICMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | R-PDSO-G24 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | SSOP | SSOP24,.24 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | MATTE TIN | GULL WING | 635 µm | DUAL | 1.75 mm | 3.9 mm | 8.65 mm | MAXIM INTEGRATED PRODUCTS INC | SSOP | 0.150 INCH, 0.025 INCH PITCH, LEAD FREE, MO-137AE, QSOP-24 | 24 | compliant | EAR99 | 8542.39.00.01 | |||||||||
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N8X470I
Philips Semiconductors
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Check for Price | No | Obsolete | 16 | 2 | NO | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | 2 | 5.25 V | 4.75 V | COMMERCIAL | R-XDIP-T24 | Not Qualified | e0 | 70 °C | 24 | CERAMIC | DIP | DIP24,.4 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | PHILIPS SEMICONDUCTORS | DIP, DIP24,.4 | unknown | EAR99 | 8542.39.00.01 | ||||||||||||||||||
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N8X470N
Philips Semiconductors
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Check for Price | No | Obsolete | 16 | 2 | NO | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | 2 | 5.25 V | 4.75 V | COMMERCIAL | R-PDIP-T24 | Not Qualified | e0 | 70 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.4 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | PHILIPS SEMICONDUCTORS | DIP, DIP24,.4 | unknown | EAR99 | 8542.39.00.01 | ||||||||||||||||||
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SSI34B580-P
Silicon Systems Inc
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Check for Price | No | Obsolete | 4 | NO | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | BIPOLAR | 1 | 5.25 V | 4.75 V | COMMERCIAL | R-PDIP-T28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SILICON SYSTEMS INC | DIP, DIP28,.6 | unknown | EAR99 | 8542.39.00.01 | ||||||||||||||||||
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SSI580CD
Silicon Systems Inc
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Check for Price | No | Obsolete | 4 | NO | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | BIPOLAR | 1 | 5.25 V | 4.75 V | COMMERCIAL | R-XDIP-T28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SILICON SYSTEMS INC | DIP, DIP28,.6 | unknown | EAR99 | 8542.39.00.01 | ||||||||||||||||||
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MAX7322AEE-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 4 | YES | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 8 | 5.5 V | 2.7 V | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e0 | 125 °C | -40 °C | 16 | PLASTIC/EPOXY | SSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | TIN LEAD | GULL WING | 635 µm | DUAL | 1.75 mm | 3.9 mm | 4.89 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | 0.150 INCH, 0.250 INCH LEAD PITCH, LEAD FREE, PLASTIC QSOP-16 | 16 | not_compliant | EAR99 | 8542.39.00.01 | |||||||||||
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MAX7322ATE-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 4 | YES | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 8 | 5.5 V | 2.7 V | AUTOMOTIVE | S-PQCC-N16 | Not Qualified | e0 | 125 °C | -40 °C | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, LEADFREE, PLASTIC, TQFN-16 | 16 | not_compliant | EAR99 | 8542.39.00.01 | |||||||||||
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MAX7323ATE+
Analog Devices Inc
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Check for Price | Yes | Active | 8 | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | ANALOG DEVICES INC | 16-LFCSP-3X3X0.75 | 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 | 16 | compliant | 16-LFCSP-3X3X0.75 | 2007-09-18 | Analog Devices | |||||||
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935277495118
NXP Semiconductors
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Check for Price | Obsolete | 400 kHz | 4 | YES | 3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 2.3 V | INDUSTRIAL | S-PDSO-G10 | 85 °C | -40 °C | 10 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GULL WING | 500 µm | DUAL | 1.1 mm | 3 mm | 3 mm | NXP SEMICONDUCTORS | TSSOP, | unknown | EAR99 | 8542.39.00.01 | ||||||||||||||||||
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MAX7323ATE+T
Analog Devices Inc
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Check for Price | Yes | Active | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | ANALOG DEVICES INC | 16-LFCSP-3X3X0.75 | 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 | 16 | compliant | 16-LFCSP-3X3X0.75 | 2007-09-18 | Analog Devices |