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Parametric results for: Parallel IO Ports

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Sorted By: Number of Ports
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BU8272GUW
 ROHM Semiconductor 		Check for Price Yes Yes Obsolete 400 kHz 20 YES 1.8 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 0 1.95 V 1.65 V S-PBGA-B35 Not Qualified e1 NOT SPECIFIED NOT SPECIFIED 35 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 900 µm 4 mm 4 mm ROHM CO LTD BGA VFBGA, 35 compliant EAR99 8542.39.00.01
MAX1609EEE+T
 Analog Devices Inc 		Check for Price Yes Active 8 YES 5 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 0 5.5 V 2.7 V INDUSTRIAL R-PDSO-G16 Not Qualified e3 1 85 °C -40 °C 260 30 16 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH Matte Tin (Sn) GULL WING 635 µm DUAL 1.73 mm 3.9 mm 4.89 mm 16-QSOP-150_MIL 16 16-QSOP-150_MIL 2000-01-01 Analog Devices
TMP68230P-10
 Toshiba America Electronic Components 		Check for Price Obsolete NO 5 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 0 5.5 V 4.5 V R-PDIP-T48 Not Qualified 48 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE THROUGH-HOLE 2.54 mm DUAL 5.08 mm 15.24 mm 61.72 mm TOSHIBA CORP DIP DIP, 48 unknown EAR99 8542.39.00.01
MR8251A/B
 Rochester Electronics LLC 		Check for Price No Active YES 5 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 0 5.5 V 4.5 V MILITARY S-XQCC-N28 125 °C -55 °C NOT SPECIFIED NOT SPECIFIED 28 UNSPECIFIED QCCN SQUARE CHIP CARRIER NO LEAD 1.27 mm QUAD 2 mm 11.43 mm 11.43 mm ROCHESTER ELECTRONICS LLC HERMETIC SEALED PACKAGE-28 unknown EAR99 8542.39.00.01
MAX1608EEE+
 Analog Devices Inc 		Check for Price Yes Active 8 YES 5 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 0 5.5 V 2.7 V INDUSTRIAL R-PDSO-G16 Not Qualified e3 1 85 °C -40 °C 260 30 16 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH Matte Tin (Sn) - annealed GULL WING 635 µm DUAL 1.73 mm 3.9 mm 4.89 mm 16-QSOP-150_MIL 16 16-QSOP-150_MIL 2000-01-01 Analog Devices
MR8251A/B
 Intel Corporation 		Check for Price Obsolete 8 YES 5 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 0 5.5 V 4.5 V MILITARY S-XQCC-N28 Not Qualified 125 °C -55 °C 28 UNSPECIFIED QCCN SQUARE CHIP CARRIER NO LEAD 1.27 mm QUAD 2 mm 11.43 mm 11.43 mm INTEL CORP QFN HERMETIC SEALED PACKAGE-28 28 unknown EAR99 8542.39.00.01
BU1850MUV-E2
 ROHM Semiconductor 		$0.8613 Yes Yes Obsolete 8 400 kHz 8 YES 1.8 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 0 3.6 V 1.65 V OTHER S-XQCC-N16 Not Qualified 85 °C -30 °C NOT SPECIFIED NOT SPECIFIED 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 500 µm QUAD 1 mm 3 mm 3 mm ROHM CO LTD QFN HVQCCN, LCC16,.12SQ,20 16 compliant EAR99 8542.39.00.01 ROHM Semiconductor
MAX1609EEE+T
 Maxim Integrated Products 		Check for Price Yes Yes Transferred 8 YES 5 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 0 5.5 V 2.7 V INDUSTRIAL R-PDSO-G16 Not Qualified e3 1 85 °C -40 °C 260 30 16 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH MATTE TIN GULL WING 635 µm DUAL 1.73 mm 3.9 mm 4.89 mm MAXIM INTEGRATED PRODUCTS INC SOIC SSOP, 16 compliant EAR99 8542.39.00.01
KU82961KA-20
 Intel Corporation 		Check for Price No Obsolete 32 40 MHz YES 5 V PARALLEL IO PORT, PRINTER INTERFACE MOS 0 250 mA 5.25 V 4.75 V OTHER S-PQFP-G132 Not Qualified e0 85 °C 132 PLASTIC/EPOXY QFP SPQFP132,1.1SQ SQUARE FLATPACK TIN LEAD GULL WING 635 µm QUAD 4.57 mm 24.13 mm 24.13 mm INTEL CORP QFP QFP, SPQFP132,1.1SQ 132 compliant EAR99 8542.39.00.01
MAX1609EEE
 Maxim Integrated Products 		Check for Price No No Obsolete 8 YES 5 V PARALLEL IO PORT, GENERAL PURPOSE CMOS 0 5.5 V 2.7 V INDUSTRIAL R-PDSO-G16 Not Qualified e0 1 85 °C -40 °C 240 20 16 PLASTIC/EPOXY HSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH TIN LEAD GULL WING 635 µm DUAL 1.75 mm 3.9 mm 4.9 mm MAXIM INTEGRATED PRODUCTS INC SSOP 0.150 INCH, 0.025 INCH PITCH, MO-137D, QSOP-16 16 not_compliant EAR99 8542.39.00.01
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