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41 - 50 of 5,063 results
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RF3284TR13
Qorvo
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Check for Price | Yes | Obsolete | 3.5 V | CMOS | RF AND BASEBAND CIRCUIT | 1 | 20 nA | OTHER | R-XBCC-B30 | Not Qualified | 85 °C | -30 °C | 30 | UNSPECIFIED | HVBCC | LCC30,.24X.28,30 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | BUTT | 750 µm | BOTTOM | 6 mm | 7 mm | 1 mm | QORVO INC | HVBCC, LCC30,.24X.28,30 | compliant | 8542.39.00.01 | ||||||||||||||
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ACFM-7101-TR1G
Broadcom Limited
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Check for Price | Yes | Obsolete | BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-XXMA-X6 | Not Qualified | 3 | 100 °C | -40 °C | 260 | 6 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | BROADCOM LTD | , | compliant | 8542.39.00.01 | EAR99 | ||||||||||||||||||||
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HMC687LP4
Hittite Microwave Corp
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Check for Price | No | No | Transferred | 5 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N24 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 235 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | HITTITE MICROWAVE CORP | HVQCCN, | compliant | 8542.39.00.01 | EAR99 | QFN | 24 | ||||||||
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MAX2308ETI-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 2.75 V | BASEBAND CIRCUIT | 1 | 41.5 µA | INDUSTRIAL | S-XQCC-N28 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 28 | UNSPECIFIED | HVQCCN | LCC28,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 | not_compliant | 8542.39.00.01 | QFN | 28 | |||||||||
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LT5570IDD#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PDSO-N10 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 3 mm | 3 mm | 800 µm | LINEAR TECHNOLOGY CORP | 3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-2, DFN-10 | compliant | 8542.39.00.01 | DFN | 10 | DD | |||||||||
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HMC683LP6C
Analog Devices Inc
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Check for Price | No | Active | 5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N40 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 40 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 900 µm | ANALOG DEVICES INC | 6 X 6 MM, PLASTIC, SMT-40 | compliant | 8542.39.00.01 | EAR99 | |||||||||||||
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BTS7202HJ
NXP Semiconductors
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Check for Price | Yes | Active | RF AND BASEBAND CIRCUIT | 1 | 260 | NXP SEMICONDUCTORS | compliant | ||||||||||||||||||||||||||||||||||||
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MAX2365ETM
Maxim Integrated Products
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Check for Price | No | Obsolete | 2.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N48 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 7 mm | 7 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, | compliant | 8542.39.00.01 | EAR99 | QFN | 48 | |||||||||||
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LMH2120UM
Texas Instruments
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Check for Price | Obsolete | 2.7 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBGA-B6 | Not Qualified | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 400 µm | BOTTOM | 825 µm | 1.225 mm | 470 µm | TEXAS INSTRUMENTS INC | VFBGA, | unknown | 8542.39.00.01 | BGA | 6 | ||||||||||||||||
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453-00012R
LAIRD PLC
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Check for Price | Yes | Active | RF AND BASEBAND CIRCUIT | NOT SPECIFIED | NOT SPECIFIED | LAIRD TECHNOLOGIES INC | unknown | 8542.39.00.01 | 2019-06-26 |