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DS26524GNA5
Maxim Integrated Products
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Check for Price | No | No | Obsolete | TIME SLOT 0/16 TRANSCEIVER | NOT SPECIFIED | NOT SPECIFIED | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | |||||||||||||||||||||||||||||||||
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TTSI001041BL-2
LSI Corporation
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Check for Price | No | No | Transferred | 1.5 V | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | LSI CORP | compliant | 8542.39.00.01 | BGA | BGA, | 240 | |||||||||||
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BT8390KPF
Synaptics Incorporated
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Check for Price | No | Active | 5 V | CMOS | FRAMER | 1 | 175 mA | COMMERCIAL | R-PQFP-G128 | e0 | Not Qualified | 70 °C | 128 | PLASTIC/EPOXY | QFP | QFP128,.55X.93,20 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | SYNAPTICS INC | compliant | 8542.39.00.01 | QFP, QFP128,.55X.93,20 | |||||||||||||||
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DS2181AQN
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | FRAMER | 1 | 10 mA | INDUSTRIAL | S-PQCC-J44 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | MAXIM INTEGRATED PRODUCTS INC | not_compliant | 8542.39.00.01 | LCC | PLASTIC, LCC-44 | 44 | EAR99 | |||||
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PEB20560V2.1
Lantiq
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Check for Price | Transferred | 3.3 V | CMOS | TIME SLOT ASSIGNER | 1 | COMMERCIAL | S-PQFP-G160 | Not Qualified | 70 °C | 160 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | GULL WING | 650 µm | QUAD | 28 mm | 28 mm | 2.75 mm | LANTIQ | unknown | 8542.39.00.01 | QFP | METRIC, PLASTIC, QFP-160 | 160 | |||||||||||||||
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KT8555J
Samsung Semiconductor
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Check for Price | No | Obsolete | 5 V | CMOS | TIME SLOT ASSIGNER | 1 | 1.5 µA | OTHER | R-GDIP-T20 | e0 | Not Qualified | 125 °C | -20 °C | 20 | CERAMIC, GLASS-SEALED | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 25.855 mm | 5.08 mm | SAMSUNG SEMICONDUCTOR INC | unknown | 8542.39.00.01 | DIP | DIP, DIP20,.3 | 20 | |||||||||
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DS2155G+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 3.3 V | CEPT PCM-30/E-1 | FRAMER | 1 | COMMERCIAL | S-PBGA-B100 | e3 | Not Qualified | 3 | 70 °C | 100 | PLASTIC/EPOXY | FBGA | BGA100,10X10,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | 10 mm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | BGA | 10 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, CSBGA-100 | 100 | EAR99 | |||||||||
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DS3172N+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 3.3 V | FRAMER | 1 | 328 mA | INDUSTRIAL | S-PBGA-B400 | Not Qualified | 3 | 85 °C | -40 °C | 400 | PLASTIC/EPOXY | BGA | BGA400,20X20,50 | SQUARE | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.54 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | BGA | 27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400 | 400 | EAR99 | |||||||||
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DS3160C01
Maxim Integrated Products
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Check for Price | No | Obsolete | 3.3 V | CMOS | FRAMER | 1 | OTHER | S-PQFP-G100 | e0 | Not Qualified | 85 °C | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MAXIM INTEGRATED PRODUCTS INC | not_compliant | 8542.39.00.01 | QFP | LFQFP, QFP100,.63SQ,20 | 100 | |||||||||||
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PM4358-NI
Microsemi Corporation
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Check for Price | No | Transferred | 1.8 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PBGA-B256 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | MICROSEMI CORP | unknown | 8542.39.00.01 | 17 X 17 MM, CABGA-256 |