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41 - 50 of 26,040 results
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MC68160AFB
Motorola Semiconductor Products
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Check for Price | No | Transferred | 5 V | BICMOS | 1 | 10 Gbps | ETHERNET TRANSCEIVER | 1 | 200 mA | COMMERCIAL | S-PQFP-G52 | e0 | Not Qualified | 70 °C | 52 | PLASTIC/EPOXY | LQFP | QFP52,.47SQ | SQUARE | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 650 µm | QUAD | 10 mm | 10 mm | 1.7 mm | MOTOROLA INC | PLASTIC, LQFP-52 | unknown | 8542.39.00.01 | ||||||||||||
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MAX13342EEBC+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 2.5 V | BICMOS | INTERFACE CIRCUIT | 1 | INDUSTRIAL | R-PBGA-B12 | e1 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.54 mm | 2.12 mm | 670 µm | MAXIM INTEGRATED PRODUCTS INC | VFBGA, | compliant | 8542.39.00.01 | BGA | 12 | 5A991 | ||||||||
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BU-67402F3HL-450S
Data Device Corporation
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Check for Price | Active | 5 V | BICMOS | 2 | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | MILITARY | S-PDFP-F36 | e0 | 125 °C | -55 °C | MIL-PRF-38534 Class H | 36 | PLASTIC/EPOXY | QFF | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 25.4 mm | 25.4 mm | 6.35 mm | DATA DEVICE CORP | FLATPACK-36 | compliant | 8542.39.00.01 | 2016-04-08 | ||||||||||||||
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BU-67402F3HL-450W
Data Device Corporation
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Check for Price | Active | 5 V | BICMOS | 2 | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | MILITARY | S-PDFP-F36 | e0 | 125 °C | -55 °C | MIL-PRF-38534 Class H | 36 | PLASTIC/EPOXY | QFF | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 25.4 mm | 25.4 mm | 6.35 mm | DATA DEVICE CORP | FLATPACK-36 | compliant | 8542.39.00.01 | 2016-04-08 | ||||||||||||||
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MAX13054ASA+T
Maxim Integrated Products
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$4.6990 | Yes | Yes | Transferred | 5 V | BICMOS | 1 | 1 Gbps | CAN TRANSCEIVER | 1 | AUTOMOTIVE | R-PDSO-G8 | e3 | Not Qualified | 1 | 125 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | MAXIM INTEGRATED PRODUCTS INC | SOP, SOP8,.25 | compliant | 8542.39.00.01 | SOIC | 8 | EAR99 | |||||
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BU-67402G3HL-140Q
Data Device Corporation
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Check for Price | Active | 5 V | BICMOS | 2 | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | MILITARY | S-PDSO-G36 | e0 | 125 °C | -55 °C | MIL-PRF-38534 Class H | 36 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 25.4 mm | 25.4 mm | 6.35 mm | DATA DEVICE CORP | GULLWING-36 | compliant | 8542.39.00.01 | 2016-04-08 | ||||||||||||||
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BU-67402G3HL-140S
Data Device Corporation
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Check for Price | Active | 5 V | BICMOS | 2 | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | MILITARY | S-PDSO-G36 | e0 | 125 °C | -55 °C | MIL-PRF-38534 Class H | 36 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 25.4 mm | 25.4 mm | 6.35 mm | DATA DEVICE CORP | SOP, | compliant | 8542.39.00.01 | 2016-04-08 | ||||||||||||||
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MAX2828ETN+
Maxim Integrated Products
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$20.7836 | Yes | Yes | Transferred | 2.7 V | BICMOS | SUPPORT CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N56 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 8 mm | 8 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, | compliant | 8542.39.00.01 | QFN | 56 | 5A991.B | ||||||||
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CYV15G0101DXB-BBXI
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 3.3 V | BICMOS | 1 | 1.5 Tbps | INTERFACE CIRCUIT | 1 | 510 µA | INDUSTRIAL | S-PBGA-B100 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 20 | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 11 mm | 11 mm | 1.4 mm | CYPRESS SEMICONDUCTOR CORP | BGA-100 | unknown | 8542.39.00.01 | BGA | 100 | ||||||
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MAX4890ETJ+T
Maxim Integrated Products
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$5.4594 | Yes | Yes | Transferred | 3.3 V | BICMOS | LAN SWITCHING CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N32 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, | compliant | 8542.39.00.01 | QFN | 32 | EAR99 |