Parametric results for: Network Interfaces

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MC68160AFB
Motorola Semiconductor Products
Check for Price No Transferred 5 V BICMOS 1 10 Gbps ETHERNET TRANSCEIVER 1 200 mA COMMERCIAL S-PQFP-G52 e0 Not Qualified 70 °C 52 PLASTIC/EPOXY LQFP QFP52,.47SQ SQUARE FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 650 µm QUAD 10 mm 10 mm 1.7 mm MOTOROLA INC PLASTIC, LQFP-52 unknown 8542.39.00.01
MAX13342EEBC+T
Maxim Integrated Products
Check for Price Yes Yes Obsolete 2.5 V BICMOS INTERFACE CIRCUIT 1 INDUSTRIAL R-PBGA-B12 e1 Not Qualified 1 85 °C -40 °C 260 30 12 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1.54 mm 2.12 mm 670 µm MAXIM INTEGRATED PRODUCTS INC VFBGA, compliant 8542.39.00.01 BGA 12 5A991
BU-67402F3HL-450S
Data Device Corporation
Check for Price Active 5 V BICMOS 2 MIL-STD-1553 DATA BUS TRANSCEIVER 1 MILITARY S-PDFP-F36 e0 125 °C -55 °C MIL-PRF-38534 Class H 36 PLASTIC/EPOXY QFF SQUARE FLATPACK YES Tin/Lead (Sn/Pb) FLAT 1.27 mm DUAL 25.4 mm 25.4 mm 6.35 mm DATA DEVICE CORP FLATPACK-36 compliant 8542.39.00.01 2016-04-08
BU-67402F3HL-450W
Data Device Corporation
Check for Price Active 5 V BICMOS 2 MIL-STD-1553 DATA BUS TRANSCEIVER 1 MILITARY S-PDFP-F36 e0 125 °C -55 °C MIL-PRF-38534 Class H 36 PLASTIC/EPOXY QFF SQUARE FLATPACK YES Tin/Lead (Sn/Pb) FLAT 1.27 mm DUAL 25.4 mm 25.4 mm 6.35 mm DATA DEVICE CORP FLATPACK-36 compliant 8542.39.00.01 2016-04-08
MAX13054ASA+T
Maxim Integrated Products
$4.6990 Yes Yes Transferred 5 V BICMOS 1 1 Gbps CAN TRANSCEIVER 1 AUTOMOTIVE R-PDSO-G8 e3 Not Qualified 1 125 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 3.9 mm 4.9 mm 1.75 mm MAXIM INTEGRATED PRODUCTS INC SOP, SOP8,.25 compliant 8542.39.00.01 SOIC 8 EAR99
BU-67402G3HL-140Q
Data Device Corporation
Check for Price Active 5 V BICMOS 2 MIL-STD-1553 DATA BUS TRANSCEIVER 1 MILITARY S-PDSO-G36 e0 125 °C -55 °C MIL-PRF-38534 Class H 36 PLASTIC/EPOXY SOP SQUARE SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 25.4 mm 25.4 mm 6.35 mm DATA DEVICE CORP GULLWING-36 compliant 8542.39.00.01 2016-04-08
BU-67402G3HL-140S
Data Device Corporation
Check for Price Active 5 V BICMOS 2 MIL-STD-1553 DATA BUS TRANSCEIVER 1 MILITARY S-PDSO-G36 e0 125 °C -55 °C MIL-PRF-38534 Class H 36 PLASTIC/EPOXY SOP SQUARE SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 25.4 mm 25.4 mm 6.35 mm DATA DEVICE CORP SOP, compliant 8542.39.00.01 2016-04-08
MAX2828ETN+
Maxim Integrated Products
$20.7836 Yes Yes Transferred 2.7 V BICMOS SUPPORT CIRCUIT 1 INDUSTRIAL S-XQCC-N56 e3 Not Qualified 3 85 °C -40 °C 260 30 56 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 8 mm 8 mm 800 µm MAXIM INTEGRATED PRODUCTS INC HVQCCN, compliant 8542.39.00.01 QFN 56 5A991.B
CYV15G0101DXB-BBXI
Cypress Semiconductor
Check for Price Yes Obsolete 3.3 V BICMOS 1 1.5 Tbps INTERFACE CIRCUIT 1 510 µA INDUSTRIAL S-PBGA-B100 e1 Not Qualified 3 85 °C -40 °C 260 20 100 PLASTIC/EPOXY LBGA BGA100,10X10,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 11 mm 11 mm 1.4 mm CYPRESS SEMICONDUCTOR CORP BGA-100 unknown 8542.39.00.01 BGA 100
MAX4890ETJ+T
Maxim Integrated Products
$5.4594 Yes Yes Transferred 3.3 V BICMOS LAN SWITCHING CIRCUIT 1 INDUSTRIAL S-XQCC-N32 e3 Not Qualified 1 85 °C -40 °C 260 30 32 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 5 mm 5 mm 800 µm MAXIM INTEGRATED PRODUCTS INC HVQCCN, compliant 8542.39.00.01 QFN 32 EAR99