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41 - 50 of 26,042 results
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KSZ9893RNXI
Microchip Technology Inc
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$11.1926 | Yes | Active | 1.2 V | ETHERNET SWITCH | 1 | INDUSTRIAL | S-PQCC-N64 | e3 | 3 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) - annealed | NO LEAD | 400 µm | QUAD | 8 mm | 8 mm | 900 µm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.39.00.01 | 2018-02-16 | Microchip | ||||||||||||||||
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KSZ8895RQXIA
Microchip Technology Inc
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$6.6008 | Yes | Active | 1.2 V | CMOS | 5 | 100 Gbps | ETHERNET SWITCH | 1 | INDUSTRIAL | R-PQFP-G128 | e3 | 85 °C | -40 °C | 128 | PLASTIC/EPOXY | FQFP | QFP128,.68X.91,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.39.00.01 | Microchip | FQFP, | ||||||||||||||
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AMIS42770ICAW1RG
onsemi
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$4.0287 | Yes | End Of Life | 5 V | 2 | 1 Gbps | INTERFACE CIRCUIT | 1 | 137.5 µA | AUTOMOTIVE | R-PDSO-G20 | e3 | Not Qualified | 2 | 125 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5184 mm | 12.7762 mm | 2.6416 mm | ONSEMI | compliant | 8542.39.00.01 | onsemi | SOIC-20 | SOIC-20 Wide Body | 20 | 751AQ | ||||||||
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LAN8820I-ABZJ
Microchip Technology Inc
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$4.5752 | Yes | Active | 1.2 V | 1 | 1 Tbps | ETHERNET TRANSCEIVER | 1 | INDUSTRIAL | S-XQCC-N56 | e3 | 85 °C | -40 °C | TS 16949 | 56 | UNSPECIFIED | HVQCCN | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 8 mm | 8 mm | 1 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.39.00.01 | Microchip | QFN-56 | QFN | 56 | ||||||||||||
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KSZ9893RNXC
Microchip Technology Inc
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$7.4467 | Yes | Active | 1.2 V | ETHERNET SWITCH | 1 | COMMERCIAL | S-PQCC-N64 | e3 | 3 | 70 °C | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) - annealed | NO LEAD | 400 µm | QUAD | 8 mm | 8 mm | 900 µm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.39.00.01 | 2018-02-16 | Microchip | |||||||||||||||||
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KSZ8001L
Microchip Technology Inc
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$3.4182 | Yes | Active | 1.8 V | CMOS | 1 | 100 Gbps | ETHERNET TRANSCEIVER | 1 | COMMERCIAL | S-PQFP-G48 | e3 | Not Qualified | 3 | 70 °C | 260 | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8517.70.00.00 | Microchip | LEAD FREE, LQFP-48 | ||||||||||||
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LAN8742A-CZ
Microchip Technology Inc
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$0.9971 | Yes | Active | 1.2 V | 1 | 100 Gbps | ETHERNET TRANSCEIVER | 1 | COMMERCIAL | S-PQCC-N24 | e3 | 70 °C | TS 16949 | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.39.00.01 | Microchip | HVQCCN, | |||||||||||||||
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MCP2551-I/SN
Microchip Technology Inc
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$0.9934 | Yes | Yes | Not Recommended | 5 V | 1 | 1 Gbps | CAN TRANSCEIVER | 1 | 75 mA | INDUSTRIAL | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.39.00.01 | Microchip | SOIC-8 | SOIC | 8 | ||||||
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KSZ8863RLL
Micrel Inc
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$2.5338 | Yes | Transferred | 1.8 V | LAN SWITCHING CIRCUIT | 1 | COMMERCIAL | S-PQFP-G48 | e3 | Not Qualified | 3 | 70 °C | 48 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | MICREL INC | compliant | ROHS COMPLIANT, LQFP-48 | ||||||||||||||||||||
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TJA1043TK
NXP Semiconductors
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Check for Price | Yes | Active | 5 V | 1 | 5 Gbps | INTERFACE CIRCUIT | 1 | 109 mA | R-PDSO-N14 | AEC-Q100 | 14 | PLASTIC/EPOXY | HVSON | DILCC14,.12x0.18,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 650 µm | DUAL | 3 mm | 4.5 mm | 1 mm | NXP SEMICONDUCTORS | compliant | EAR99 | 8542.39.00.01 | NXP | HVSON, DILCC14,.12x0.18,25 |