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BGS12AL74E6327XTSA1
Infineon Technologies AG
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$0.4348 | Yes | Obsolete | 2.8 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B6 | e4 | 1 | 85 °C | -30 °C | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | GOLD | BUTT | 550 µm | BOTTOM | 1.5 mm | 2.3 mm | 500 µm | INFINEON TECHNOLOGIES AG | HALOGEN FREE AND ROHS COMPLIANT, TSLP-7/6 | compliant | 8542.39.00.01 | Infineon | ||||||||||
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BGS12PN10E6327XTSA1
Infineon Technologies AG
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$0.4360 | Yes | Yes | Active | 2.85 V | CMOS | TELECOM CIRCUIT | 1 | OTHER | R-PBCC-N10 | 1 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 10 | PLASTIC/EPOXY | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | NO LEAD | 400 µm | BOTTOM | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | VQCCN, | compliant | 8542.39.00.01 | Infineon | ||||||||
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BGSA12GN10E6327XTSA1
Infineon Technologies AG
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$0.4361 | Yes | Yes | Active | 2.85 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B10 | 1 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 10 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | BCC, | compliant | 8542.39.00.01 | Infineon | |||||||||
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BGA5H1BN6E6327XTSA1
Infineon Technologies AG
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$0.4380 | Yes | Active | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XBCC-B6 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | BCC, | compliant | 8542.39.00.01 | Infineon | 2018-04-13 | |||||||||
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ATA5577M3330C-DDB
Microchip Technology Inc
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$0.4390 | Active | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | UNSPECIFIED | 524 µm | UPPER | 1 mm | 1.35 mm | 162 µm | MICROCHIP TECHNOLOGY INC | WAFER | compliant | 8523.59.00.00 | Microchip | 5A991.G | ||||||||||||||
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ATA5577M233AC-DBB
Microchip Technology Inc
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$0.4390 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | compliant | 8523.59.00.00 | 5A991.G | |||||||||||||||||
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ATA5577M3330C-DBB
Microchip Technology Inc
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$0.4390 | Yes | Active | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | UNSPECIFIED | 524 µm | UPPER | 1 mm | 1.35 mm | 192 µm | MICROCHIP TECHNOLOGY INC | WAFER | compliant | 8523.59.00.00 | Microchip | 5A991.G | |||||||||||||
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ATA5577M233SC-DBB
Microchip Technology Inc
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$0.4390 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | compliant | 8523.59.00.00 | Microchip | 5A991.G | ||||||||||||||||
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ATA5577M2330C-DBB
Microchip Technology Inc
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$0.4390 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | Not Qualified | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | compliant | 8523.59.00.00 | Microchip | 5A991.G | |||||||||||||||
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ATA5577M3331C-DBB
Microchip Technology Inc
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$0.4390 | Active | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | UNSPECIFIED | 524 µm | UPPER | 1 mm | 1.35 mm | 192 µm | MICROCHIP TECHNOLOGY INC | WAFER | compliant | 8523.59.00.00 | Microchip | 5A991.G |