Parametric results for: EVAL-AD5063EBZ under Other Telecom ICs

Filter Your Search

41 - 50 of 45,145 results

|
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Select parts from the table below to compare.
Compare
Compare
BGS13GA14E6327XTSA1
Infineon Technologies AG
$0.3264 Yes Yes Obsolete 3 V CMOS TELECOM CIRCUIT 1 INDUSTRIAL S-XBCC-B14 e4 1 85 °C -40 °C 14 UNSPECIFIED BCC SQUARE CHIP CARRIER YES GOLD NICKEL BUTT 400 µm BOTTOM 2 mm 2 mm 650 µm INFINEON TECHNOLOGIES AG ATSLP-14 compliant 8542.39.00.01 Infineon
AP2281-3WG-7
Diodes Incorporated
$0.3278 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-G6 3 85 °C -40 °C 260 30 6 PLASTIC/EPOXY LSSOP TSOP6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.45 mm DIODES INC SOT-26, 6 PIN compliant 8542.39.00.01 SOT 6 EAR99 NO 6 V 1.5 V
ATA8401C-6AQY-66
Microchip Technology Inc
$0.3380 Yes Active 3 V TELECOM CIRCUIT 1 11.6 µA INDUSTRIAL S-PDSO-G8 e3 Not Qualified 85 °C -55 °C 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 3 mm 3 mm 1.05 mm MICROCHIP TECHNOLOGY INC LEAD FREE, TSSOP-8 compliant 8542.31.00.01 Microchip 5A991.G
BGS14GA14E6327XTSA1
Infineon Technologies AG
$0.3397 Yes Yes Obsolete 3 V TELECOM CIRCUIT 1 OTHER S-XQMA-B14 e4 1 85 °C -30 °C 14 UNSPECIFIED SQUARE MICROELECTRONIC ASSEMBLY YES GOLD NICKEL BUTT QUAD 2 mm 2 mm 650 µm INFINEON TECHNOLOGIES AG ROHS COMPLIANT, ATSLP-14 compliant 8542.39.00.01 Infineon
SL2S5002FTB,115
NXP Semiconductors
$0.3411 Yes Active CMOS TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-N3 e3 1 85 °C -40 °C 260 30 3 PLASTIC/EPOXY VSON RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE YES Tin (Sn) NO LEAD 550 µm DUAL 1 mm 1.45 mm 500 µm NXP SEMICONDUCTORS 1.45 X 1 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT1122, XSON-3 compliant NXP SON 3 SOT1122
AP2281-1FMG-7
Diodes Incorporated
$0.3443 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-N6 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.07,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.81 mm 2 mm 605 µm DIODES INC DFN-6 compliant 8542.39.00.01 DFN 6 EAR99 NO 6 V 1.5 V
AT88RF04C-MVA1
Microchip Technology Inc
$0.3444 Yes Not Recommended CMOS SYNCHRONOUS 1 R-XXMA-N 70 °C -25 °C UNSPECIFIED XMA RECTANGULAR MICROELECTRONIC ASSEMBLY YES NO LEAD UNSPECIFIED MICROCHIP TECHNOLOGY INC compliant 8523.52.00.90 Microchip 5A992.C 4.096 kbit CRYPTO MEMORY 8 512 words 512 512X8
HTSH5601ETK,118
NXP Semiconductors
$0.3486 Yes Active TELECOM CIRCUIT 1 OTHER R-PDSO-N2 Not Qualified 1 85 °C -25 °C 260 30 2 PLASTIC/EPOXY SON LCC2(UNSPEC) RECTANGULAR SMALL OUTLINE YES NO LEAD DUAL NXP SEMICONDUCTORS 3 X 2 MM, 0.85 MM HEIGHT, PLASTIC, SOT899-1, HVSON-2 compliant NXP SON 2 SOT899-1
AP2281-1WG-7
Diodes Incorporated
$0.3519 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-G6 3 85 °C -40 °C 260 30 6 PLASTIC/EPOXY LSSOP TSOP6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.45 mm DIODES INC LSSOP, compliant 8542.39.00.01 SOT 6 EAR99 NO 6 V 1.5 V
BGA5L1BN6E6327XTSA1
Infineon Technologies AG
$0.3537 Yes Obsolete 1.8 V TELECOM CIRCUIT 1 INDUSTRIAL R-XBCC-B6 1 85 °C -40 °C 6 UNSPECIFIED BCC RECTANGULAR CHIP CARRIER YES BUTT 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG TSNP-6 compliant 8542.39.00.01 Infineon 2018-04-13