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31 - 40 of 4,164 results
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S2559E-P
AMI Semiconductor
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Check for Price | No | Obsolete | 5 V | CMOS | TELEPHONE DIALER CIRCUIT | 3.58 MHz | 1 | 16 mA | COMMERCIAL | R-PDIP-T16 | e0 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 19.495 mm | 4.32 mm | AMI SEMICONDUCTOR | PLASTIC, DIP-16 | unknown | |||||||||
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W91434
Winbond Electronics Corp
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Check for Price | No | Obsolete | 2.5 V | CMOS | 3.58 MHz | REPERTORY | 1 mA | COMMERCIAL | R-PDIP-T18 | e0 | Not Qualified | 70 °C | -20 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | WINBOND ELECTRONICS CORP | not_compliant | 8542.39.00.01 | ||||||||||||
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KS58015D
Samsung Semiconductor
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Check for Price | No | Obsolete | 3 V | CMOS | TELEPHONE DIALER CIRCUIT | 3.58 MHz | 1 | 1.5 µA | OTHER | R-PDSO-G14 | e0 | Not Qualified | 70 °C | -30 °C | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3.95 mm | 8.56 mm | 1.95 mm | SAMSUNG SEMICONDUCTOR INC | 0.225 INCH, SOP-14 | unknown | 8542.39.00.01 | SOIC | 14 | |||||
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WE9104
Winbond Electronics Corp
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Check for Price | No | Obsolete | CMOS | 200 µA | COMMERCIAL | R-PDIP-T16 | e0 | Not Qualified | 60 °C | -20 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | WINBOND ELECTRONICS CORP | not_compliant | 8542.39.00.01 | |||||||||||||||
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XR-T5992CP
Exar Corporation
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Check for Price | No | Transferred | CMOS | 150 µA | COMMERCIAL | R-PDIP-T18 | e0 | Not Qualified | 70 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | EXAR CORP | DIP, DIP18,.3 | compliant | 8542.39.00.01 | |||||||||||||||
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HT9245A
Holtek Semiconductor Inc
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Check for Price | No | Contact Manufacturer | CMOS | 3.58 MHz | 2 mA | COMMERCIAL | R-PDIP-T22 | e0 | Not Qualified | 70 °C | -20 °C | 22 | PLASTIC/EPOXY | DIP | DIP22(UNSPEC) | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | DUAL | HOLTEK SEMICONDUCTOR INC | unknown | 8542.39.00.01 | |||||||||||||||
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TP5600N/A+
Texas Instruments
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Check for Price | No | Obsolete | CMOS | REPERTORY | 150 µA | OTHER | R-PDIP-T16 | e0 | 70 °C | -30 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | NATIONAL SEMICONDUCTOR CORP | DIP, DIP16,.3 | unknown | 8542.39.00.01 | ||||||||||||||
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W91473L
Winbond Electronics Corp
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Check for Price | Obsolete | 2.5 V | CMOS | TELEPHONE DIALER CIRCUIT | 3.58 MHz | 2:3 | 1 | REPERTORY | 500 nA | COMMERCIAL | R-PDIP-T22 | e3 | Not Qualified | 70 °C | -20 °C | 22 | PLASTIC/EPOXY | DIP | DIP22,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | WINBOND ELECTRONICS CORP | DIP, DIP22,.3 | unknown | 8542.39.00.01 | DIP | 22 | |||||||
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PCD3332-3T
NXP Semiconductors
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Check for Price | Obsolete | 5 V | CMOS | TELEPHONE MULTIFUNCTION CIRCUIT | SELECTABLE MAKE/BREAK RATIO 3:2 | 3.58 MHz | 2:1 | 1 | REPERTORY | 1.8 mA | OTHER | R-PDSO-G28 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 17.9 mm | 2.65 mm | NXP SEMICONDUCTORS | SOP, SOP28,.4 | compliant | 8542.39.00.01 | TSSOP | 28 | |||||
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W91534AN
Winbond Electronics Corp
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Check for Price | No | Obsolete | 2.5 V | CMOS | TELEPHONE DIALER CIRCUIT | 3.58 MHz | 2:3 | 1 | REPERTORY | 600 nA | COMMERCIAL | R-PDIP-T20 | e0 | Not Qualified | 70 °C | -20 °C | 20 | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 20.06 mm | 4.45 mm | WINBOND ELECTRONICS CORP | DIP, DIP20,.3 | not_compliant | 8542.39.00.01 | DIP | 20 |